Invention Grant
- Patent Title: Suspension board with circuit
- Patent Title (中): 悬挂板带电路
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Application No.: US14878319Application Date: 2015-10-08
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Publication No.: US09502058B2Publication Date: 2016-11-22
- Inventor: Yoshito Fujimura , Hiroyuki Tanabe , Saori Kanezaki , Naohiro Terada , Yuu Sugimoto
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils LLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2014-210618 20141015
- Main IPC: G11B5/48
- IPC: G11B5/48

Abstract:
A suspension board with circuit includes a metal supporting layer, an insulating base layer on one side thereof in a thickness direction, a conductive pattern disposed on the insulating base layer, an insulating cover layer disposed on the insulating base layer so as to cover the conductive pattern, and a pedestal for supporting a slider which includes a thin pedestal portion. The thin pedestal portion includes a pedestal base layer included in the insulating base layer, a pedestal conductive layer included in the conductive pattern which extends over the pedestal base layer, and a pedestal cover layer included in the insulating cover layer and disposed on the pedestal conductive layer. The conductive pattern includes a first wire placed to extend over the insulating base layer which has a narrower portion, and a dimension of the pedestal conductive layer is 0.5 to 3 times the dimension of the narrower portion.
Public/Granted literature
- US20160111115A1 SUSPENSION BOARD WITH CIRCUIT Public/Granted day:2016-04-21
Information query
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