发明授权
- 专利标题： Integrated circuit packaging system with support structure and method of manufacture thereof
- 专利标题（中）： 具有支撑结构的集成电路封装系统及其制造方法
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申请号： US14316190申请日： 2014-06-26
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公开(公告)号： US09502267B1公开(公告)日： 2016-11-22
- 发明人: HeeJo Chi , Bartholomew Liao Chung Foh , Sheila Marie L. Alvarez , Zigmund Ramirez Camacho , Dao Nguyen Phu Cuong
- 申请人： HeeJo Chi , Bartholomew Liao Chung Foh , Sheila Marie L. Alvarez , Zigmund Ramirez Camacho , Dao Nguyen Phu Cuong
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Pte. Ltd.
- 当前专利权人： STATS ChipPAC Pte. Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Wong & Rees LLP
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L21/56 ; H01L23/538
摘要：
An integrated circuit packaging system, and a method of manufacture thereof, includes: a support structure having: an internal insulation layer having a hole, a device connection side, and a removal mark characteristic of a conductive seed layer removed at the device connection side, a first conductive pad in the hole at the device connection side, and an exterior insulation layer over the first conductive pad at the device connection side; an integrated circuit over the exterior insulation layer; and an encapsulation over the integrated circuit.
信息查询
IPC分类:
