Invention Grant
- Patent Title: Nonvolatile memory device and a method for fabricating the same
- Patent Title (中): 非易失存储器件及其制造方法
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Application No.: US13927914Application Date: 2013-06-26
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Publication No.: US09502332B2Publication Date: 2016-11-22
- Inventor: Jong-Heun Lim , Hyo-Jung Kim , Ji-Woon Im , Kyung-Hyun Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2012-0090784 20120820
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L27/115

Abstract:
A nonvolatile memory device including a substrate which includes a cell array region and a connection region, an electrode structure formed on the cell array region and the connection region and including a plurality of laminated electrodes, a first recess formed in the electrode structure on the connection region and disposed between the cell array region and a second recess formed in the electrode structure on the connection region, and a plurality of vertical wirings formed on the plurality of electrodes exposed by the first recess.
Public/Granted literature
- US20140048945A1 NONVOLATILE MEMORY DEVICE AND A METHOD FOR FABRICATING THE SAME Public/Granted day:2014-02-20
Information query
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