Invention Grant
US09502361B2 Electronic device with stacked chips 有权
具有堆叠芯片的电子设备

Electronic device with stacked chips
Abstract:
An electronic device includes a first and a second integrated-circuit chip that are stacked at a distance from one another, and a plurality of electrical connection pillars and at least one protective barrier interposed between the chips. The protective barrier delimits a free space between mutually opposing local regions of the chips, and an encapsulation block extends around the chip that has the smaller mounting face and over the periphery of the mounting face of the other chip. The electrical connection pillars and the protective barrier are made of at least one identical metallic material with a view to simultaneous fabrication.
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