Invention Grant
- Patent Title: Electronic device with stacked chips
- Patent Title (中): 具有堆叠芯片的电子设备
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Application No.: US14852711Application Date: 2015-09-14
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Publication No.: US09502361B2Publication Date: 2016-11-22
- Inventor: Romain Coffy , Julien Pruvost
- Applicant: STMicroelectronics (Grenoble 2) SAS
- Applicant Address: FR Grenoble
- Assignee: STMicroelectronics (Grenoble 2) SAS
- Current Assignee: STMicroelectronics (Grenoble 2) SAS
- Current Assignee Address: FR Grenoble
- Agency: Gardere Wynne Sewell LLP
- Priority: FR1461285 20141121
- Main IPC: H01L23/488
- IPC: H01L23/488 ; H01L23/00 ; B81C3/00 ; H01L23/31 ; H01L25/065 ; H01L21/48 ; H01L21/56 ; H01L23/14 ; H01L23/498 ; H01L25/00

Abstract:
An electronic device includes a first and a second integrated-circuit chip that are stacked at a distance from one another, and a plurality of electrical connection pillars and at least one protective barrier interposed between the chips. The protective barrier delimits a free space between mutually opposing local regions of the chips, and an encapsulation block extends around the chip that has the smaller mounting face and over the periphery of the mounting face of the other chip. The electrical connection pillars and the protective barrier are made of at least one identical metallic material with a view to simultaneous fabrication.
Public/Granted literature
- US20160148880A1 ELECTRONIC DEVICE WITH STACKED CHIPS Public/Granted day:2016-05-26
Information query
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