Invention Grant
- Patent Title: Automatic wire tail adjustment system for wire bonders
- Patent Title (中): 线焊机自动线尾调整系统
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Application No.: US13658957Application Date: 2012-10-24
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Publication No.: US09502374B2Publication Date: 2016-11-22
- Inventor: Keng Yew Song , Wai Wah Lee , Yi Bin Wang , Wen Hua Guo , Xin Wei Zhang
- Applicant: Keng Yew Song , Wai Wah Lee , Yi Bin Wang , Wen Hua Guo , Xin Wei Zhang
- Applicant Address: SG Singapore
- Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD.
- Current Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD.
- Current Assignee Address: SG Singapore
- Agency: Ostrolenk Faber LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; B23K35/02 ; B23K20/00

Abstract:
A capillary is utilized to form the wedge wire bond comprised in a wire interconnection. A wire holding device is located above a wire clamp and the capillary to secure the wire while the wire clamp is open and not clamping onto the wire. The wire clamp and the capillary may be lifted relative to the wire in a direction away from the wedge wire bond and towards the wire holding device so as to pay out a length of wire from the capillary. At a predetermined height of the capillary, the wire clamp is closed to clamp onto the wire, and thereafter, the capillary and wire clamp may be moved further away from the wedge wire bond to cause the wire to break away from the wedge wire bond and to form the wire tail with a desired length extending from the capillary.
Public/Granted literature
- US20130098877A1 AUTOMATIC WIRE TAIL ADJUSTMENT SYSTEM FOR WIRE BONDERS Public/Granted day:2013-04-25
Information query
IPC分类: