公开(公告)号：US20150008251A1

公开(公告)日：2015-01-08

申请号：US14320851

申请日：2014-07-01

Applicant: Keng Yew SONG ,  Yi Bin WANG ,  Zuo Cheng SHEN ,  Jia Le LUO ,  Qing Le TAN

Inventor： Keng Yew SONG ,  Yi Bin WANG ,  Zuo Cheng SHEN ,  Jia Le LUO ,  Qing Le TAN

IPC: H01L21/66 ,  B23K3/08 ,  H01L23/00 ,  B23K3/06

CPC classification number: H01L24/78 ,  B23K20/007 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/78 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/789 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: Disclosed is a method of measuring a free air ball size during a wire bonding process of a wire bonder, which comprises a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire. Specifically, the method comprises the steps of: forming a free air ball from a wire tail of the bonding wire; using the position sensor to determine a positional difference between a first and a second position of the bonding tool with respect to a reference position, wherein the first position of the bonding tool is a position of the bonding tool with respect to the reference position when the free air ball contacts a conductive surface; and measuring the free air ball size based on the positional difference of the bonding tool as determined by the position sensor. A wire bonder configured to perform such a method is also disclosed.

Abstract translation: 公开了一种在引线接合机的引线接合工艺期间测量自由空气球尺寸的方法，其包括位置传感器和用于使用接合线在半导体器件和基板之间形成电连接的接合工具。 具体地说，该方法包括以下步骤：从接合线的线尾形成自由空气球; 使用所述位置传感器来确定所述接合工具相对于参考位置的第一和第二位置之间的位置差异，其中所述接合工具的所述第一位置是所述接合工具相对于所述参考位置的位置， 自由空气球接触导电表面; 并且基于由位置传感器确定的接合工具的位置差来测量自由空气球尺寸。 还公开了构造成执行这种方法的引线接合器。

公开(公告)号：US20140209663A1

公开(公告)日：2014-07-31

申请号：US14162336

申请日：2014-01-23

Applicant: Keng Yew SONG ,  Wai Wah LEE ,  Yi Bin WANG

Inventor： Keng Yew SONG ,  Wai Wah LEE ,  Yi Bin WANG

IPC: H01L23/00

CPC classification number: H01L24/78 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48247 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/78801 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

Abstract: Disclosed is a wire bonder comprising: a processor; a bond head coupled to the processor, the processor being configured to control motion of the bond head; a bonding tool mounted to the bond head, the bonding tool being drivable by the bond head to form an electrical interconnection between a semiconductor die and a substrate to which the semiconductor die is mounted using a bonding wire; and a measuring device coupled to the bond head, the measuring device being operable to measure a deformation of a bonding portion of the bonding wire as the bonding tool is driven by the bond head to connect the bonding wire to the semiconductor die via the bonding portion. Specifically, the processor is configured to derive at least one correlation between the measured deformation of the bonding portion and an operating parameter of the wire bonder; compare the at least one derived correlation against a predetermined correlation between the operating parameter of the wire bonder and a desired deformation of the bonding portion; and calibrate the operating parameter of the wire bonder based on the comparison between the at least one derived correlation and the predetermined correlation of the deformation of the bonding portion against the operating parameter of the wire bonder. A method of calibrating a wire bonder is also disclosed.

Abstract translation: 公开了一种引线键合机，包括：处理器; 耦合到所述处理器的接合头，所述处理器被配置为控制所述接合头的运动; 粘合工具安装到接合头，所述接合工具可由所述接合头驱动，以在半导体管芯和使用接合线安装所述半导体管芯的衬底之间形成电互连; 以及耦合到所述接合头的测量装置，所述测量装置可操作以在所述接合工具由所述接合头驱动时测量所述接合线的接合部的变形，以通过所述接合部将所述接合线连接到所述半导体管芯 。 具体地，处理器被配置为导出测量的接合部分的变形与引线接合器的操作参数之间的至少一个相关性; 将所述至少一个导出相关性与所述引线接合器的操作参数与所述接合部分的期望变形之间的预定相关性进行比较; 并且基于所述至少一个导出的相关性与所述接合部的变形与所述引线接合器的操作参数的预定相关性之间的比较来校准所述引线接合器的操作参数。 还公开了一种校准引线接合器的方法。

公开(公告)号：US10163845B2

公开(公告)日：2018-12-25

申请号：US14320851

申请日：2014-07-01

Applicant: Keng Yew Song ,  Yi Bin Wang ,  Zuo Cheng Shen ,  Jia Le Luo ,  Qing Le Tan

Inventor： Keng Yew Song ,  Yi Bin Wang ,  Zuo Cheng Shen ,  Jia Le Luo ,  Qing Le Tan

IPC: B23K20/00 ,  H01L23/00

Abstract: Disclosed is a method of measuring a free air ball size during a wire bonding process of a wire bonder, which comprises a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire. Specifically, the method comprises the steps of: forming a free air ball from a wire tail of the bonding wire; using the position sensor to determine a positional difference between a first and a second position of the bonding tool with respect to a reference position, wherein the first position of the bonding tool is a position of the bonding tool with respect to the reference position when the free air ball contacts a conductive surface; and measuring the free air ball size based on the positional difference of the bonding tool as determined by the position sensor. A wire bonder configured to perform such a method is also disclosed.

公开(公告)号：US09502374B2

公开(公告)日：2016-11-22

申请号：US13658957

申请日：2012-10-24

Applicant: Keng Yew Song ,  Wai Wah Lee ,  Yi Bin Wang ,  Wen Hua Guo ,  Xin Wei Zhang

Inventor： Keng Yew Song ,  Wai Wah Lee ,  Yi Bin Wang ,  Wen Hua Guo ,  Xin Wei Zhang

IPC: H01L23/00 ,  B23K35/02 ,  B23K20/00

CPC classification number: H01L24/78 ,  B23K20/007 ,  B23K35/0261 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48477 ,  H01L2224/78301 ,  H01L2224/78611 ,  H01L2224/78621 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A capillary is utilized to form the wedge wire bond comprised in a wire interconnection. A wire holding device is located above a wire clamp and the capillary to secure the wire while the wire clamp is open and not clamping onto the wire. The wire clamp and the capillary may be lifted relative to the wire in a direction away from the wedge wire bond and towards the wire holding device so as to pay out a length of wire from the capillary. At a predetermined height of the capillary, the wire clamp is closed to clamp onto the wire, and thereafter, the capillary and wire clamp may be moved further away from the wedge wire bond to cause the wire to break away from the wedge wire bond and to form the wire tail with a desired length extending from the capillary.

Abstract translation: 利用毛细管形成包括在电线互连中的楔形线接合。 电线夹持装置位于线夹和毛细管上方，以固定线，而线钳打开而不夹在线上。 线夹和毛细管可以相对于导线沿远离楔形线接合的方向并且朝着线保持装置提升，从而从毛细管支付一定长度的线。 在毛细管的预定高度处，线夹被封闭以夹紧在线上，此后，毛细管和线夹可以进一步远离楔形线接合，以使线从楔形线接合处脱离，并且 以形成从毛细管延伸的期望长度的线尾。

公开(公告)号：US07494042B2

公开(公告)日：2009-02-24

申请号：US10677604

申请日：2003-10-02

Applicant: Yam Mo Wong ,  Yi Bin Wang ,  Wei Liu

Inventor： Yam Mo Wong ,  Yi Bin Wang ,  Wei Liu

IPC: B23K31/02

CPC classification number: H01L24/85 ,  B23K20/004 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48095 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A method of bonding wire between first and second bonding points with a bonding tool, such as a capillary, is disclosed. A first bond is formed at the first bonding point with the bonding tool, and further steps include moving the bonding tool away from the first bond by a first distance, then moving the bonding tool towards the first bonding point and coupling the wire to the first bond. Thereafter, the bonding tool is moved away from the first bond by a second distance and a kink is formed in the wire. The bonding tool is subsequently moved to extend a sufficient length of wire to form a wire loop between the first and second bonding points before the bonding tool is moved to the second bonding point to form a second bond. Characteristics of wire bonds formable using the method are also disclosed.

Abstract translation: 公开了一种使用诸如毛细管的接合工具在第一和第二接合点之间接合线的方法。 在与焊接工具的第一接合点处形成第一接合，并且其它步骤包括使接合工具远离第一接合移动第一距离，然后将接合工具朝向第一接合点移动并将接合线耦合到第一接合点 键。 此后，接合工具从第一接合部移开第二距离，并且在线中形成扭结。 接合工具随后移动以延伸足够长的线，以在接合工具移动到第二接合点之前形成第一和第二接合点之间的线环，以形成第二接合。 还公开了使用该方法可形成的丝焊的特性。

公开(公告)号：US09620477B2

公开(公告)日：2017-04-11

申请号：US14162336

申请日：2014-01-23

Applicant: Keng Yew Song ,  Wai Wah Lee ,  Yi Bin Wang

Inventor： Keng Yew Song ,  Wai Wah Lee ,  Yi Bin Wang

IPC: B23K31/02 ,  H01L23/00

CPC classification number: H01L24/78 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48247 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/78801 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

Abstract: Disclosed is a wire bonder comprising: a processor; a bond head coupled to the processor, the processor being configured to control motion of the bond head; a bonding tool mounted to the bond head, the bonding tool being drivable by the bond head to form an electrical interconnection between a semiconductor die and a substrate to which the semiconductor die is mounted using a bonding wire; and a measuring device coupled to the bond head, the measuring device being operable to measure a deformation of a bonding portion of the bonding wire as the bonding tool is driven by the bond head to connect the bonding wire to the semiconductor die via the bonding portion. Specifically, the processor is configured to derive at least one correlation between the measured deformation of the bonding portion and an operating parameter of the wire bonder; compare the at least one derived correlation against a predetermined correlation between the operating parameter of the wire bonder and a desired deformation of the bonding portion; and calibrate the operating parameter of the wire bonder based on the comparison between the at least one derived correlation and the predetermined correlation of the deformation of the bonding portion against the operating parameter of the wire bonder. A method of calibrating a wire bonder is also disclosed.

公开(公告)号：US20130098877A1

公开(公告)日：2013-04-25

申请号：US13658957

申请日：2012-10-24

Applicant: Keng Yew SONG ,  Wai Wah LEE ,  Yi Bin WANG ,  Wen Hua GUO ,  Xin Wei ZHANG

Inventor： Keng Yew SONG ,  Wai Wah LEE ,  Yi Bin WANG ,  Wen Hua GUO ,  Xin Wei ZHANG

IPC: B23K31/02 ,  B23H1/00

CPC classification number: H01L24/78 ,  B23K20/007 ,  B23K35/0261 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48477 ,  H01L2224/78301 ,  H01L2224/78611 ,  H01L2224/78621 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A capillary is utilized to form the wedge wire bond comprised in a wire interconnection. A wire holding device is located above a wire clamp and the capillary to secure the wire while the wire clamp is open and not clamping onto the wire. The wire clamp and the capillary may be lifted relative to the wire in a direction away from the wedge wire bond and towards the wire holding device so as to pay out a length of wire from the capillary. At a predetermined height of the capillary, the wire clamp is closed to clamp onto the wire, and thereafter, the capillary and wire clamp may be moved further away from the wedge wire bond to cause the wire to break away from the wedge wire bond and to form the wire tail with a desired length extending from the capillary.

Abstract translation: 利用毛细管形成包括在电线互连中的楔形线接合。 电线夹持装置位于电线夹和毛细管上方，以固定电线，同时电线夹打开而不夹在电线上。 线夹和毛细管可以相对于导线沿远离楔形线接合的方向并且朝着线保持装置提升，从而从毛细管支付一定长度的线。 在毛细管的预定高度处，线夹被封闭以夹紧在线上，此后，毛细管和线夹可以进一步远离楔形线接合，以使线从楔形线接合处脱离，并且 以形成从毛细管延伸的期望长度的线尾。