Invention Grant
- Patent Title: Circuit component bridge device
- Patent Title (中): 电路元件桥接器件
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Application No.: US14169423Application Date: 2014-01-31
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Publication No.: US09504159B2Publication Date: 2016-11-22
- Inventor: Beom-Taek Lee , Raul Enriquez-Shibayama , Carolina Garcia Robles
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: International IP Law Group, P.L.L.C.
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/18 ; H05K1/02 ; H05K3/40 ; H05K1/14 ; H05K3/34
Abstract:
A bridge device is described herein. The bridge device may include a first via of a bridge device, the first via of the bridge device having a short via stub or no via stub, the first via of the bridge device to be communicatively coupled to a first via of a printed circuit board (PCB). The bridge device may include a second via of the bridge device, the second via of the bridge device having a short via stub or no via stub, the second via of the bridge device to be communicatively coupled to a second via of the PCB. A trace of the bridge device may communicatively couple the first via of the bridge device to the second via of the bridge device.
Public/Granted literature
- US20150223336A1 CIRCUIT COMPONENT BRIDGE DEVICE Public/Granted day:2015-08-06
Information query
