Invention Grant
US09505887B2 Polyimide polymer, polyimide film, and flexible copper-coated laminate
有权
聚酰亚胺聚合物，聚酰亚胺膜和柔性铜包覆层压板
- Patent Title: Polyimide polymer, polyimide film, and flexible copper-coated laminate
- Patent Title (中): 聚酰亚胺聚合物，聚酰亚胺膜和柔性铜包覆层压板
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Application No.: US14565420Application Date: 2014-12-10
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Publication No.: US09505887B2Publication Date: 2016-11-29
- Inventor: Yi-Kai Fang , Tsung-Tai Hung , Chiao-Pei Chen , Chiu-Feng Chen , Ching-Hung Huang
- Applicant: TAIFLEX Scientific Co., Ltd.
- Applicant Address: TW Kaohsiung
- Assignee: TAIFLEX Scientific Co., Ltd.
- Current Assignee: TAIFLEX Scientific Co., Ltd.
- Current Assignee Address: TW Kaohsiung
- Agency: Jianq Chyun IP Office
- Priority: TW103137208A 20141028
- Main IPC: C08G73/10
- IPC: C08G73/10 ; H05K1/03 ; C09D179/08
Abstract:
A polyimide polymer represented by the following formula 1 is provided. In formula 1, Ar is Ar′ is A is and 0
Public/Granted literature
- US20160115277A1 POLYIMIDE POLYMER, POLYIMIDE FILM, AND FLEXIBLE COPPER-COATED LAMINATE Public/Granted day:2016-04-28
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