摘要:
A composition and a solution for temporary bonding are provided. The composition includes a dianhydride monomer, a light-absorbing monomer, and a light-absorbing material. The light-absorbing monomer includes at least one of N,N,N,N-(p-aminophenyl)-p-phenylenediamine (DPDA) and N,N-(p-aminophenyl)-p-phenylenediamine (TPDA). The light-absorbing material includes carbon black and silicon dioxide.
摘要:
A polyimide polymer is provided. The polyimide polymer includes a repeating unit represented by formula 1. In formula 1, Ar is a tetravalent organic group derived from a tetracarboxylic dianhydride containing an aliphatic structure, and A includes and at least one divalent organic group derived from an aromatic group-containing diamine other than
摘要:
An adhesive composition is provided. The adhesive composition includes an organic silicon polymer, a silicon coupling agent, carboxylic polyester, and a solvent. Based on the total weight of the adhesive composition, the content of the organic silicon polymer is 10 wt % to 60 wt %, the content of the silicon coupling agent is 10 wt % to 60 wt %, and the content of the carboxylic polyester is 10 wt % to 60 wt %.
摘要:
A method of transferring micro devices is provided. A carrier substrate having a first surface and a second surface opposite to each other is provided, wherein a plurality of micro devices is disposed on the first surface, and each micro device binds to the first surface through laser debonding gel. Next, a receiving substrate is subjected to be relatively closer to the first surface, and a mask is provided on the second surface. Afterwards, the second surface with the mask is irradiated with a laser light, so as to keep the micro devices without laser irradiation binding on the first surface, and the micro devices irradiated with the laser light lose adhesive force and transfer to the receiving substrate.
摘要:
A photosensitive composition is provided. The photosensitive composition includes a composition for forming polyimide, a photoinitiator, a photo cross-linking agent, and a thermal cross-linking agent. The composition for forming polyimide includes a diamine monomer component, an anhydride monomer component, and a polyimide modifier. The diamine monomer component includes a long-chain aliphatic diamine monomer, a carboxylic acid-containing diamine monomer, and a triazole compound. The anhydride monomer component includes a dianhydride monomer and a monoanhydride monomer. The polyimide modifier has a double bond and an epoxy group.
摘要:
A polyimide is provided. The polyimide includes a repeating unit represented by formula 1: wherein Ar is a tetravalent residue obtainable from an aromatic tetracarboxylic dianhydride; and A includes wherein R17 is a single bond or a C1-C18 divalent linking group.
摘要:
A polyimide is provided. The polyimide includes a repeating unit represented by formula 1. In formula 1, Ar is a tetravalent residue obtainable from a tetracarboxylic dianhydride containing a fluorine-containing aromatic group or an oxygen-containing aromatic group, and A is
摘要:
An infrared absorption film includes a polymer resin substrate, a polymer dispersant and an infrared absorption material. The infrared absorption material has a plurality of tungsten oxide and/or composite tungsten oxide nanoparticles dispersed in the polymer resin substrate by the polymer dispersant, wherein a weight ratio of the polymer dispersant to the infrared absorption material is between 0.3 and 0.6.
摘要:
A method of making a soluble thermoplastic polyimide composition, which comprises the steps of: polymerizing a first diamine, a second diamine different from the first diamine, and a dianhydride in a polar aprotic solvent to obtain a polyamine acid, wherein the first diamine contains a carboxyl group; and imidizing the polyamine acid to obtain the composition, wherein the composition contains the carboxyl group. By controlling the content of the dianhydride within a range from 85 mol. % to 99 mol. % based on the total content of the first diamine and the second diamine, the soluble thermoplastic polyimide composition made from the method can be laminated with a commercial polyimide film and a metal foil via simple steps of coating, drying, and pressing, to form a polyimide metal laminate. Therefore, by utilizing the soluble thermoplastic polyimide composition made from the method, making a polyimide metal laminate is simple and economical.
摘要:
A cover film includes a release layer and a polyimide layer disposed on the release layer. The polyimide layer includes an inner surface and an outer surface opposite to the inner surface. The outer surface is exposed to the atmosphere, and the polyimide layer is formed from a reaction of a polyimide composition made of diamine monomer and tetracarboxylic dianhydride monomer. The polyimide layer further includes a cross-linker and an initiator. The diamine monomer is an aliphatic diamine monomer with a number of carbon greater than or equal to 36. A lowest viscosity of the polyimide layer is less than 20000 Pa·s when polyimide layer is under a temperature in a range of 60° C. to 160° C.