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公开(公告)号：US20190292429A1
公开(公告)日：2019-09-26
申请号：US16016660
申请日：2018-06-25
Applicant: TAIFLEX Scientific Co., Ltd.
Inventor： Hsiu-Ming Chang , Tsung-Tai Hung , Li-Jung Hsiao , Po-Wen Lin
Abstract: A composition and a solution for temporary bonding are provided. The composition includes a dianhydride monomer, a light-absorbing monomer, and a light-absorbing material. The light-absorbing monomer includes at least one of N,N,N,N-(p-aminophenyl)-p-phenylenediamine (DPDA) and N,N-(p-aminophenyl)-p-phenylenediamine (TPDA). The light-absorbing material includes carbon black and silicon dioxide.
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2.发明授权公开(公告)号：US09505887B2
公开(公告)日：2016-11-29
申请号：US14565420
申请日：2014-12-10
Applicant: TAIFLEX Scientific Co., Ltd.
Inventor： Yi-Kai Fang , Tsung-Tai Hung , Chiao-Pei Chen , Chiu-Feng Chen , Ching-Hung Huang
IPC: C08G73/10 , H05K1/03 , C09D179/08
CPC classification number: H05K1/0313 , C08G73/1028 , C08G73/1042 , C08G73/105 , C08G73/1078 , C09D179/08 , H05K1/028 , H05K1/0346 , H05K1/09 , H05K2201/0154 , H05K2201/068
Abstract: A polyimide polymer represented by the following formula 1 is provided. In formula 1, Ar is Ar′ is A is and 0
Abstract translation: 0
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公开(公告)号：US20190103274A1
公开(公告)日：2019-04-04
申请号：US15826728
申请日：2017-11-30
Applicant: TAIFLEX Scientific Co., Ltd.
Inventor： Hsiu-Ming Chang , Po-Wen Lin , Tsung-Tai Hung
IPC: H01L21/263 , H01L27/15 , H01L21/67 , H01L33/00
Abstract: A method of transferring micro devices is provided. A carrier substrate having a first surface and a second surface opposite to each other is provided, wherein a plurality of micro devices is disposed on the first surface, and each micro device binds to the first surface through laser debonding gel. Next, a receiving substrate is subjected to be relatively closer to the first surface, and a mask is provided on the second surface. Afterwards, the second surface with the mask is irradiated with a laser light, so as to keep the micro devices without laser irradiation binding on the first surface, and the micro devices irradiated with the laser light lose adhesive force and transfer to the receiving substrate.
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公开(公告)号：US20170152348A1
公开(公告)日：2017-06-01
申请号：US15016288
申请日：2016-02-05
Applicant: TAIFLEX Scientific Co., Ltd.
Inventor： Yi-Kai Fang , Tsung-Tai Hung , Chiao-Pei Chen , Pin-Shiuan Chen , Ching-Hung Huang
CPC classification number: C08G73/1082 , C08G73/1039 , C08G73/1053 , C08J5/18 , C08J2379/08 , C09D179/08
Abstract: A polyimide is provided. The polyimide includes a repeating unit represented by formula 1. In formula 1, Ar is a tetravalent residue obtainable from a tetracarboxylic dianhydride containing a fluorine-containing aromatic group or an oxygen-containing aromatic group, and A is
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Patent Agency Ranking
5.发明申请公开(公告)号：US20170034910A1
公开(公告)日：2017-02-02
申请号：US15296055
申请日：2016-10-18
Applicant: TAIFLEX Scientific Co., Ltd.
Inventor： Yi-Kai Fang , Tsung-Tai Hung , Chiao-Pei Chen , Chiu-Feng Chen , Ching-Hung Huang
IPC: H05K1/03 , H05K1/02 , H05K1/09 , C08G73/10 , C09D179/08
CPC classification number: H05K1/0313 , C08G73/1028 , C08G73/1042 , C08G73/105 , C08G73/1078 , C09D179/08 , H05K1/028 , H05K1/0346 , H05K1/09 , H05K2201/0154 , H05K2201/068
Abstract: A polyimide polymer represented by the following formula 1 is provided. In formula 1, Ar is Ar′ is A is and 0
Abstract translation: 0
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6.发明申请公开(公告)号：US20160088728A1
公开(公告)日：2016-03-24
申请号：US14530833
申请日：2014-11-03
Applicant: TAIFLEX Scientific Co., Ltd.
Inventor： Fu-Min Wang , Tsung-Tai Hung , I-Ling Teng , Feng-Jung Tien , Yu-Hsien Lee , Tzu-Ching Hung
CPC classification number: H05K3/386 , H05K1/0237 , H05K1/118
Abstract: An insulation film of a signal transmission line includes a substrate layer, and a bonding layer arranged on the substrate layer for directly covering metal conductors of the signal transmission line, wherein the bonding layer is made of a polyolefin copolymer resin or a polyolefin resin mixture.
Abstract translation: 信号传输线的绝缘膜包括基底层和布置在基底层上用于直接覆盖信号传输线的金属导体的接合层，其中粘合层由聚烯烃共聚树脂或聚烯烃树脂混合物制成。
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公开(公告)号：US09955572B2
公开(公告)日：2018-04-24
申请号：US15296055
申请日：2016-10-18
Applicant: TAIFLEX Scientific Co., Ltd.
Inventor： Yi-Kai Fang , Tsung-Tai Hung , Chiao-Pei Chen , Chiu-Feng Chen , Ching-Hung Huang
IPC: H05K1/03 , C08G73/10 , C09D179/08 , H05K1/02 , H05K1/09
CPC classification number: H05K1/0313 , C08G73/1028 , C08G73/1042 , C08G73/105 , C08G73/1078 , C09D179/08 , H05K1/028 , H05K1/0346 , H05K1/09 , H05K2201/0154 , H05K2201/068
Abstract: A polyimide polymer represented by the following formula 1 is provided. In formula 1, Ar is Ar′ is A is and 0
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公开(公告)号：US20180086952A1
公开(公告)日：2018-03-29
申请号：US15358148
申请日：2016-11-22
Applicant: TAIFLEX Scientific Co., Ltd.
Inventor： I-Ling Teng , Tzu-Ching Hung , Chiao-Pei Chen , Yu-Hsien Lee , Tsung-Tai Hung , Bo-Sheng Wang , Cheng-Yen Hsiao , Chen-Hsin Huang
IPC: C09J125/08 , B32B7/12 , B32B15/08
CPC classification number: C09J125/08 , B32B7/12 , B32B15/08 , B32B15/085 , B32B15/20 , B32B27/32 , B32B2250/40 , B32B2255/06 , B32B2255/10 , B32B2255/26 , B32B2255/28 , B32B2307/714 , B32B2307/752 , B32B2553/00 , C08K5/098 , C09J153/025
Abstract: An adhesive composition is provided. The adhesive composition includes a mixture (A), wherein the mixture (A) includes a first component (a), a cross-linking agent (b), and a second component (c), wherein the second component (c) includes a calcium-containing complex compound or a calcium-containing compound. Based on the total weight of the mixture (A), a content of the first component (a) is from 40 to 80 wt %, a content of the cross-linking agent (b) is from 20 to 60 wt %, and a content of the second component (c) is from 1 to 20 wt %. Specifically, the calcium-containing complex compound is selected from the group consisting of a compound represented by formula (1), a compound represented by formula (2), a compound represented by formula (3), and a compound represent by formula (4), and the calcium-containing compound is selected from the group consisting of a compound represented by formula (5) and a compound represent by formula (6).
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9.发明申请公开(公告)号：US20160115277A1
公开(公告)日：2016-04-28
申请号：US14565420
申请日：2014-12-10
Applicant: TAIFLEX Scientific Co., Ltd.
Inventor： Yi-Kai Fang , Tsung-Tai Hung , Chiao-Pei Chen , Chiu-Feng Chen , Ching-Hung Huang
CPC classification number: H05K1/0313 , C08G73/1028 , C08G73/1042 , C08G73/105 , C08G73/1078 , C09D179/08 , H05K1/028 , H05K1/0346 , H05K1/09 , H05K2201/0154 , H05K2201/068
Abstract: A polyimide polymer represented by the following formula 1 is provided. In formula 1, Ar is Ar′ is A is and 0
Abstract translation: 提供由下式1表示的聚酰亚胺聚合物。 在式1中，Ar为Ar'为A且0
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