Invention Grant
- Patent Title: Stair step formation using at least two masks
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Application No.: US14797390Application Date: 2015-07-13
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Publication No.: US09508591B2Publication Date: 2016-11-29
- Inventor: Chang Wan Ha , Graham R. Wolstenholme , Deepak Thimmegowda
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: H01L21/461
- IPC: H01L21/461 ; H01L21/768 ; H01L27/105 ; H01L21/033 ; H01L21/3213 ; H01L27/115 ; H01L23/535

Abstract:
Apparatuses and methods for stair step formation using at least two masks, such as in a memory device, are provided. One example method can include forming a first mask over a conductive material to define a first exposed area, and forming a second mask over a portion of the first exposed area to define a second exposed area, the second exposed area is less than the first exposed area. Conductive material is removed from the second exposed area. An initial first dimension of the second mask is less than a first dimension of the first exposed area and an initial second dimension of the second mask is at least a second dimension of the first exposed area plus a distance equal to a difference between the initial first dimension of the second mask and a final first dimension of the second mask after a stair step structure is formed.
Public/Granted literature
- US20150318203A1 STAIR STEP FORMATION USING AT LEAST TWO MASKS Public/Granted day:2015-11-05
Information query
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