Invention Grant
US09508612B2 Method to detect wafer arcing in semiconductor manufacturing equipment
有权
在半导体制造设备中检测晶片电弧的方法
- Patent Title: Method to detect wafer arcing in semiconductor manufacturing equipment
- Patent Title (中): 在半导体制造设备中检测晶片电弧的方法
-
Application No.: US13687754Application Date: 2012-11-28
-
Publication No.: US09508612B2Publication Date: 2016-11-29
- Inventor: Scott Singlevich , Kommisetti Subrahmanyam , Tony Davis , Michael Johnson
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/66 ; G01R31/08 ; G06F17/00
Abstract:
Methods and systems for accurate arc detection in semiconductor manufacturing tools are disclosed. Such methods and systems provide real-time arc detection and near real-time notification for corrective actions during a semiconductor manufacturing process. Such methods and systems utilize data with high sample rate and wavelet analysis to provide for more accurate arc detection, which leads to more effective and cost efficient semiconductor manufacturing operations.
Public/Granted literature
- US20130245969A1 METHOD TO DETECT WAFER ARCING IN SEMICONDUCTOR MANUFACTURING EQUIPMENT Public/Granted day:2013-09-19
Information query
