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公开(公告)号：US10283421B2
公开(公告)日：2019-05-07
申请号：US15362706
申请日：2016-11-28
Applicant: APPLIED MATERIALS, INC.
Inventor： Scott Singlevich , Kommisetti Subrahmanyam , Tony Davis , Michael Johnson
Abstract: Methods and systems for accurate arc detection in semiconductor manufacturing tools are disclosed. Such methods and systems provide real-time arc detection and near real-time notification for corrective actions during a semiconductor manufacturing process. Such methods and systems utilize data with high sample rate and wavelet analysis to provide for more accurate arc detection, which leads to more effective and cost efficient semiconductor manufacturing operations.
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2.发明申请公开(公告)号：US20170077002A1
公开(公告)日：2017-03-16
申请号：US15362706
申请日：2016-11-28
Applicant: APPLIED MATERIALS, INC.
Inventor： Scott Singlevich , Kommisetti Subrahmanyam , Tony Davis , Michael Johnson
CPC classification number: H01L22/20 , G01R31/024 , G01R31/08 , G06F17/00 , H01J37/32183 , H01J37/32541 , H01J37/32917 , H01J37/32935 , H01J37/32944 , H01J2237/3321 , H01L21/67253 , H01L22/14 , H01L2924/0002 , H01L2924/00
Abstract: Methods and systems for accurate arc detection in semiconductor manufacturing tools are disclosed. Such methods and systems provide real-time arc detection and near real-time notification for corrective actions during a semiconductor manufacturing process. Such methods and systems utilize data with high sample rate and wavelet analysis to provide for more accurate arc detection, which leads to more effective and cost efficient semiconductor manufacturing operations.
Abstract translation: 公开了用于半导体制造工具中的精确电弧检测的方法和系统。 这样的方法和系统在半导体制造过程中提供实时电弧检测和近实时通知以用于校正动作。 这种方法和系统利用具有高采样率和小波分析的数据来提供更准确的电弧检测，这导致更有效和成本有效的半导体制造操作。
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公开(公告)号：US20130245969A1
公开(公告)日：2013-09-19
申请号：US13687754
申请日：2012-11-28
Applicant: APPLIED MATERIALS, INC.
Inventor： Scott Singlevich , Kommisetti Subrahmanyam , Tony Davis , Michael Johnson
CPC classification number: H01L22/20 , G01R31/024 , G01R31/08 , G06F17/00 , H01J37/32183 , H01J37/32541 , H01J37/32917 , H01J37/32935 , H01J37/32944 , H01J2237/3321 , H01L21/67253 , H01L22/14 , H01L2924/0002 , H01L2924/00
Abstract: Methods and systems for accurate arc detection in semiconductor manufacturing tools are disclosed. Such methods and systems provide real-time arc detection and near real-time notification for corrective actions during a semiconductor manufacturing process. Such methods and systems utilize data with high sample rate and wavelet analysis to provide for more accurate arc detection, which leads to more effective and cost efficient semiconductor manufacturing operations.
Abstract translation: 公开了用于半导体制造工具中的精确电弧检测的方法和系统。 这样的方法和系统在半导体制造过程中提供实时电弧检测和近实时通知以用于校正动作。 这种方法和系统利用具有高采样率和小波分析的数据来提供更准确的电弧检测，这导致更有效和成本有效的半导体制造操作。
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4.发明授权公开(公告)号：US09508612B2
公开(公告)日：2016-11-29
申请号：US13687754
申请日：2012-11-28
Applicant: APPLIED MATERIALS, INC.
Inventor： Scott Singlevich , Kommisetti Subrahmanyam , Tony Davis , Michael Johnson
CPC classification number: H01L22/20 , G01R31/024 , G01R31/08 , G06F17/00 , H01J37/32183 , H01J37/32541 , H01J37/32917 , H01J37/32935 , H01J37/32944 , H01J2237/3321 , H01L21/67253 , H01L22/14 , H01L2924/0002 , H01L2924/00
Abstract: Methods and systems for accurate arc detection in semiconductor manufacturing tools are disclosed. Such methods and systems provide real-time arc detection and near real-time notification for corrective actions during a semiconductor manufacturing process. Such methods and systems utilize data with high sample rate and wavelet analysis to provide for more accurate arc detection, which leads to more effective and cost efficient semiconductor manufacturing operations.
Abstract translation: 公开了用于半导体制造工具中的精确电弧检测的方法和系统。 这样的方法和系统在半导体制造过程中提供实时电弧检测和近实时通知以用于校正动作。 这种方法和系统利用具有高采样率和小波分析的数据来提供更准确的电弧检测，这导致更有效和成本有效的半导体制造操作。
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