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公开(公告)号：US10283421B2
公开(公告)日：2019-05-07
申请号：US15362706
申请日：2016-11-28
Applicant: APPLIED MATERIALS, INC.
Inventor： Scott Singlevich , Kommisetti Subrahmanyam , Tony Davis , Michael Johnson
Abstract: Methods and systems for accurate arc detection in semiconductor manufacturing tools are disclosed. Such methods and systems provide real-time arc detection and near real-time notification for corrective actions during a semiconductor manufacturing process. Such methods and systems utilize data with high sample rate and wavelet analysis to provide for more accurate arc detection, which leads to more effective and cost efficient semiconductor manufacturing operations.
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Patent Agency Ranking
2.发明申请公开(公告)号：US20170077002A1
公开(公告)日：2017-03-16
申请号：US15362706
申请日：2016-11-28
Applicant: APPLIED MATERIALS, INC.
Inventor： Scott Singlevich , Kommisetti Subrahmanyam , Tony Davis , Michael Johnson
CPC classification number: H01L22/20 , G01R31/024 , G01R31/08 , G06F17/00 , H01J37/32183 , H01J37/32541 , H01J37/32917 , H01J37/32935 , H01J37/32944 , H01J2237/3321 , H01L21/67253 , H01L22/14 , H01L2924/0002 , H01L2924/00
Abstract: Methods and systems for accurate arc detection in semiconductor manufacturing tools are disclosed. Such methods and systems provide real-time arc detection and near real-time notification for corrective actions during a semiconductor manufacturing process. Such methods and systems utilize data with high sample rate and wavelet analysis to provide for more accurate arc detection, which leads to more effective and cost efficient semiconductor manufacturing operations.
Abstract translation: 公开了用于半导体制造工具中的精确电弧检测的方法和系统。 这样的方法和系统在半导体制造过程中提供实时电弧检测和近实时通知以用于校正动作。 这种方法和系统利用具有高采样率和小波分析的数据来提供更准确的电弧检测，这导致更有效和成本有效的半导体制造操作。
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3.发明授权公开(公告)号：US09429247B2
公开(公告)日：2016-08-30
申请号：US14180012
申请日：2014-02-13
Applicant: Applied Materials, Inc.
Inventor： Kommisetti Subrahmanyam , Todd J. Egan , Joseph Yudovsky , Michael Johnson
CPC classification number: F16K37/0083 , H01L21/67253 , Y10T137/8158
Abstract: A semiconductor substrate processing system having acoustic monitoring is disclosed. The system includes a process chamber adapted to perform a process on a substrate, a process fluid source, a fluid conduit coupling the fluid source to the process chamber, and a flow control valve located along the fluid conduit and adapted to be operable to control a flow of a process fluid between the process fluid source and the process chamber. The system includes one or more acoustic sensors operable to sense acoustic noise coupled to at least one of the process fluid source, the fluid conduit, and the flow control valve, and an acoustic processor adapted to receive at least one signal from the one or more acoustic sensors. Acoustic monitoring methods are provided, as are other aspects.
Abstract translation: 公开了一种具有声学监测的半导体衬底处理系统。 该系统包括适于在基板上执行处理的处理室，工艺流体源，将流体源连接到处理室的流体导管以及沿着流体导管定位的流量控制阀，并且适于可操作以控制 处理流体源和处理室之间的工艺流体的流动。 该系统包括一个或多个声学传感器，其可操作以感测耦合到过程流体源，流体导管和流量控制阀中的至少一个的声学噪声，以及适于从一个或多个 声传感器。 提供声学监测方法，以及其他方面。
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4.发明申请公开(公告)号：US20140260624A1
公开(公告)日：2014-09-18
申请号：US14180012
申请日：2014-02-13
Applicant: Applied Materials, Inc.
Inventor： Kommisetti Subrahmanyam , Todd J. Egan , Joseph Yudovsky , Michael Johnson
IPC: F16K37/00
CPC classification number: F16K37/0083 , H01L21/67253 , Y10T137/8158
Abstract: A semiconductor substrate processing system having acoustic monitoring is disclosed. The system includes a process chamber adapted to perform a process on a substrate, a process fluid source, a fluid conduit coupling the fluid source to the process chamber, and a flow control valve located along the fluid conduit and adapted to be operable to control a flow of a process fluid between the process fluid source and the process chamber. The system includes one or more acoustic sensors operable to sense acoustic noise coupled to at least one of the process fluid source, the fluid conduit, and the flow control valve, and an acoustic processor adapted to receive at least one signal from the one or more acoustic sensors. Acoustic monitoring methods are provided, as are other aspects.
Abstract translation: 公开了一种具有声学监测的半导体衬底处理系统。 该系统包括适于在基板上执行处理的处理室，工艺流体源，将流体源连接到处理室的流体导管以及沿着流体导管定位的流量控制阀，并且适于可操作以控制 处理流体源和处理室之间的工艺流体的流动。 该系统包括一个或多个声学传感器，其可操作以感测耦合到过程流体源，流体导管和流量控制阀中的至少一个的声学噪声，以及适于从一个或多个 声传感器。 提供声学监测方法，以及其他方面。
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公开(公告)号：US20130245969A1
公开(公告)日：2013-09-19
申请号：US13687754
申请日：2012-11-28
Applicant: APPLIED MATERIALS, INC.
Inventor： Scott Singlevich , Kommisetti Subrahmanyam , Tony Davis , Michael Johnson
CPC classification number: H01L22/20 , G01R31/024 , G01R31/08 , G06F17/00 , H01J37/32183 , H01J37/32541 , H01J37/32917 , H01J37/32935 , H01J37/32944 , H01J2237/3321 , H01L21/67253 , H01L22/14 , H01L2924/0002 , H01L2924/00
Abstract: Methods and systems for accurate arc detection in semiconductor manufacturing tools are disclosed. Such methods and systems provide real-time arc detection and near real-time notification for corrective actions during a semiconductor manufacturing process. Such methods and systems utilize data with high sample rate and wavelet analysis to provide for more accurate arc detection, which leads to more effective and cost efficient semiconductor manufacturing operations.
Abstract translation: 公开了用于半导体制造工具中的精确电弧检测的方法和系统。 这样的方法和系统在半导体制造过程中提供实时电弧检测和近实时通知以用于校正动作。 这种方法和系统利用具有高采样率和小波分析的数据来提供更准确的电弧检测，这导致更有效和成本有效的半导体制造操作。
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6.发明授权公开(公告)号：US09508612B2
公开(公告)日：2016-11-29
申请号：US13687754
申请日：2012-11-28
Applicant: APPLIED MATERIALS, INC.
Inventor： Scott Singlevich , Kommisetti Subrahmanyam , Tony Davis , Michael Johnson
CPC classification number: H01L22/20 , G01R31/024 , G01R31/08 , G06F17/00 , H01J37/32183 , H01J37/32541 , H01J37/32917 , H01J37/32935 , H01J37/32944 , H01J2237/3321 , H01L21/67253 , H01L22/14 , H01L2924/0002 , H01L2924/00
Abstract: Methods and systems for accurate arc detection in semiconductor manufacturing tools are disclosed. Such methods and systems provide real-time arc detection and near real-time notification for corrective actions during a semiconductor manufacturing process. Such methods and systems utilize data with high sample rate and wavelet analysis to provide for more accurate arc detection, which leads to more effective and cost efficient semiconductor manufacturing operations.
Abstract translation: 公开了用于半导体制造工具中的精确电弧检测的方法和系统。 这样的方法和系统在半导体制造过程中提供实时电弧检测和近实时通知以用于校正动作。 这种方法和系统利用具有高采样率和小波分析的数据来提供更准确的电弧检测，这导致更有效和成本有效的半导体制造操作。
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