Invention Grant
- Patent Title: Semiconductor device and semiconductor package
- Patent Title (中): 半导体器件和半导体封装
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Application No.: US14691448Application Date: 2015-04-20
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Publication No.: US09508671B2Publication Date: 2016-11-29
- Inventor: Wan-Ting Chiu , Chien-Fan Chen
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaosiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaosiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu; Angela D. Murch
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L23/00 ; H01L23/31 ; H01L23/29
Abstract:
The present disclosure relates to bonding structures useful in semiconductor packages. In an embodiment, a semiconductor device includes a semiconductor element and two pillar structures. The semiconductor element has a surface and includes at least one bonding pad disposed adjacent to the surface. The two pillar structures are disposed on the one bonding pad. The two pillar structures are symmetric and formed of a same material.
Public/Granted literature
- US20160307864A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE Public/Granted day:2016-10-20
Information query
IPC分类:
