发明授权
US09511914B2 Thermoformable multilayer films and blister packs produced therefrom
有权
可热成型的多层膜和由此产生的泡罩包装
- 专利标题： Thermoformable multilayer films and blister packs produced therefrom
- 专利标题（中）： 可热成型的多层膜和由此产生的泡罩包装
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申请号： US12551919申请日： 2009-09-01
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公开(公告)号： US09511914B2公开(公告)日： 2016-12-06
- 发明人: Stephen J. Bellamah , Ed Carmines , Rangaraj S. Sundar
- 申请人： Stephen J. Bellamah , Ed Carmines , Rangaraj S. Sundar
- 申请人地址： US VA Richmond
- 专利权人： Philip Morris USA Inc.
- 当前专利权人： Philip Morris USA Inc.
- 当前专利权人地址： US VA Richmond
- 代理机构： Roberts Mlotkowski Safran Cole & Calderon, P.C.
- 主分类号： B65D65/40
- IPC分类号： B65D65/40 ; B32B15/08 ; B32B27/08 ; B32B27/32 ; B65D75/32 ; B05D7/00 ; B29C47/06 ; C23C18/16 ; C25D7/06 ; B29K23/00 ; B29K27/06 ; B29K67/00 ; B29L31/00
摘要：
A multi-layer film structure for use in forming blister packaging. The multi-layer structure includes a first polymeric layer having a first surface and a second surface, the first polymeric layer comprising a metalized polyethylene teraphthalate, a second polymeric layer having a first surface and a second surface, the first surface of the second polymeric layer disposed adjacent the second surface of the first polymeric layer, the second polymeric layer comprising a cyclic olefin or a homopolymer of chlorotrifluoroethylene, and a third polymeric layer having a first surface and a second surface, the first surface of the third polymeric layer disposed adjacent the second surface of the second polymeric layer, the third polymeric layer comprising polypropylene or polyvinyl chloride. A method of making a multi-layer film structure and a packaging structure are also provided.