- 专利标题： High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites
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申请号： US14712125申请日： 2015-05-14
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公开(公告)号： US09512291B2公开(公告)日： 2016-12-06
- 发明人: Theodorian Borca-Tasciuc , Sushumna Iruvanti , Fengyuan Lai , Kamyar Pashayi , Joel Plawsky , Hafez Raeisi-Fard
- 申请人： International Business Machines Corporation , Rensselaer Polytechnic Institute
- 申请人地址： US NY Armonk US NY Troy
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION,RENSSELAER POLYTECHNIC INSTITUTE
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION,RENSSELAER POLYTECHNIC INSTITUTE
- 当前专利权人地址： US NY Armonk US NY Troy
- 代理机构： Scully, Scott, Murphy & Presser, P.C.
- 代理商 Steven J. Meyers
- 主分类号： C08K3/08
- IPC分类号： C08K3/08 ; B82Y30/00 ; C09K5/06 ; C09K5/14 ; C08L63/00 ; C09D139/06
摘要：
A composite structure provides high thermal conductivity as a thermal interface structure with a relatively low filler loading. The composite structure is formed by dispersing nanoparticles in a matrix at a low filler loading, and controlled sintering of the composite structure to induce agglomeration of the nanoparticles into a connected percolating thermally conducting network structure within the matrix.
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