Invention Grant
US09516746B2 Metal-clad laminate and printed wiring board 有权
覆金属层压板和印刷线路板

Metal-clad laminate and printed wiring board
Abstract:
A metal-clad laminate of the present invention includes an insulating layer and a metal layer disposed on at least one surface of the insulating layer. The insulating layer is formed by laminating at least a center layer and surface resin layers disposed on both surfaces of the center layer. The center layer contains a heat-curable resin and includes a core layer containing at least one fibrous base material and a heat-curable resin layer that does not contain a fibrous base material. The ratio of the thickness of the surface resin layer to the thickness of the heat-curable resin layer is between 0.5 and 10.
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