Invention Grant
- Patent Title: Metal-clad laminate and printed wiring board
- Patent Title (中): 覆金属层压板和印刷线路板
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Application No.: US14359909Application Date: 2012-11-21
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Publication No.: US09516746B2Publication Date: 2016-12-06
- Inventor: Koji Kishino , Hiroharu Inoue , Takeshi Kitamura
- Applicant: PANASONIC CORPORATION
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2011-254966 20111122
- International Application: PCT/JP2012/007462 WO 20121121
- International Announcement: WO2013/076973 WO 20130530
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/02 ; B32B5/02 ; B32B15/08 ; B32B15/14 ; B32B27/08 ; B32B27/12 ; B32B27/20 ; B32B17/04 ; H05K3/00 ; H05K3/02

Abstract:
A metal-clad laminate of the present invention includes an insulating layer and a metal layer disposed on at least one surface of the insulating layer. The insulating layer is formed by laminating at least a center layer and surface resin layers disposed on both surfaces of the center layer. The center layer contains a heat-curable resin and includes a core layer containing at least one fibrous base material and a heat-curable resin layer that does not contain a fibrous base material. The ratio of the thickness of the surface resin layer to the thickness of the heat-curable resin layer is between 0.5 and 10.
Public/Granted literature
- US20140311781A1 METAL-CLAD LAMINATE AND PRINTED WIRING BOARD Public/Granted day:2014-10-23
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