Invention Grant
- Patent Title: Metrology optimized inspection
- Patent Title (中): 计量优化检验
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Application No.: US14517751Application Date: 2014-10-17
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Publication No.: US09518932B2Publication Date: 2016-12-13
- Inventor: Allen Park , Craig MacNaughton , Ellis Chang
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corp.
- Current Assignee: KLA-Tencor Corp.
- Current Assignee Address: US CA Milpitas
- Agent Ann Marie Mewherter
- Main IPC: G01B11/06
- IPC: G01B11/06 ; G01N21/88 ; G03F7/00 ; G01N21/93 ; G01N21/95 ; G01N21/956 ; G03F7/20
Abstract:
Methods and systems for determining one or more parameters of a wafer inspection process are provided. One method includes acquiring metrology data for a wafer generated by a wafer metrology system. The method also includes determining one or more parameters of a wafer inspection process for the wafer or another wafer based on the metrology data.
Public/Granted literature
- US20150124247A1 Metrology Optimized Inspection Public/Granted day:2015-05-07
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