Invention Grant
- Patent Title: Package-in-package using through-hole via die on saw streets
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Application No.: US13845409Application Date: 2013-03-18
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Publication No.: US09524938B2Publication Date: 2016-12-20
- Inventor: Byung Tai Do , Heap Hoe Kuan , Seng Guan Chow
- Applicant: STATS ChipPAC, Ltd.
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Patent Law Group: Atkins and Associates, P.C.
- Agent Robert D. Atkins
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/538 ; H01L21/56 ; H01L21/683 ; H01L23/00 ; H01L25/065 ; H01L25/00 ; H01L23/31
Abstract:
A semiconductor device includes a first die having top, bottom, and peripheral surfaces. A bond pad is formed over the top surface. An organic material is connected to the first die and disposed around the peripheral surface. A via hole is formed in the organic material. A metal trace connects the via hole to the bond pad. A conductive material is deposited in the via hole. A redistribution layer (RDL) has an interconnection pad disposed over the top surface of the first die.
Public/Granted literature
- US20130214385A1 Package-in-Package Using Through-Hole Via Die on Saw Streets Public/Granted day:2013-08-22
Information query
IPC分类:
