Invention Grant
- Patent Title: Photoelectrical coversion module
- Patent Title (中): 光电转换模块
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Application No.: US14243144Application Date: 2014-04-02
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Publication No.: US09525079B2Publication Date: 2016-12-20
- Inventor: Yung-Chih Chen , Huang-Chi Tseng
- Applicant: AU Optronics Corporation
- Applicant Address: TW Hsin-Chu
- Assignee: AU OPTRONICS CORPORATION
- Current Assignee: AU OPTRONICS CORPORATION
- Current Assignee Address: TW Hsin-Chu
- Agency: WPAT, PC
- Agent Justin King
- Priority: CN201310115449 20130403
- Main IPC: H01L31/00
- IPC: H01L31/00 ; H01L31/02 ; H01L31/048 ; H01L31/05

Abstract:
A photoelectrical conversion module includes at least one photoelectrical conversion device, at least one first ribbon, a second ribbon, and at least two encapsulation layers. The photoelectrical conversion device includes a solar substrate having a plurality of finger electrodes. The first ribbon is located on the solar substrate and is intersected with the finger electrodes. The first ribbon has a first connection portion located out of the solar substrate. The second ribbon has at least one second connection portion. The first connection portion is intersected and overlapped with the second connection portion, such that a portion of the first connection portion is located above the second connection portion, and another portion of the first connection portion is located under the second connection portion. The relative position of the first and second ribbons is fixed by the encapsulation layers.
Public/Granted literature
- US20140299185A1 PHOTOELECTRICAL COVERSION MODULE Public/Granted day:2014-10-09
Information query
IPC分类: