发明授权
- 专利标题： Method for processing a substrate and apparatus for performing the same
- 专利标题（中）： 基板的加工方法及其制造方法
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申请号： US13928446申请日： 2013-06-27
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公开(公告)号： US09529267B2公开(公告)日： 2016-12-27
- 发明人: Eun-Su Rho , Jeong-Yong Bae
- 申请人： Eun-Su Rho , Jeong-Yong Bae
- 申请人地址： KR
- 专利权人： Semes Co., Ltd.
- 当前专利权人： Semes Co., Ltd.
- 当前专利权人地址： KR
- 代理机构： Daly, Crowley, Mofford & Durkee, LLP
- 优先权： KR10-2009-0058743 20090630
- 主分类号： B08B3/00
- IPC分类号： B08B3/00 ; G03F7/42 ; H01L21/67
摘要：
A method for processing a substrate includes arranging the substrate on which a photoresist layer is formed and providing a treatment liquid for removing the photoresist layer on the substrate. The method also includes providing a mist including deionized water or hydrogen peroxide on the substrate to make contact with the treatment liquid so as to increase a temperature of the treatment liquid. Therefore, efficiency of removing the photoresist layer may be improved.
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