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1.发明申请公开(公告)号：US20100326476A1
公开(公告)日：2010-12-30
申请号：US12824364
申请日：2010-06-28
申请人： Eun-Su Rho , Jeong-Yong Bae
发明人： Eun-Su Rho , Jeong-Yong Bae
CPC分类号： G03F7/422 , G03F7/423 , H01L21/6708
摘要： An apparatus for processing substrate includes a spin chuck, a first nozzle and a second nozzle. The spin chuck fixes and spins the substrate on which a photoresist layer is formed. The first nozzle is disposed over the spin chuck and provides a treatment liquid on the substrate so as to remove the photoresist layer. The second nozzle is disposed over the spin chuck and provides a mist including deionized water or hydrogen peroxide on the substrate to make contact with the treatment liquid so as to increase a temperature of the treatment liquid. Therefore, efficiency of removing the photoresist layer may be improved.
摘要翻译： 一种处理衬底的设备包括旋转卡盘，第一喷嘴和第二喷嘴。 旋转卡盘固定并旋转其上形成有光致抗蚀剂层的基板。 第一喷嘴设置在旋转卡盘上方，并在基板上提供处理液体，以除去光致抗蚀剂层。 第二喷嘴设置在旋转卡盘上方，并在基板上提供包括去离子水或过氧化氢的雾以与处理液体接触，从而提高处理液的温度。 因此，可以提高除去光致抗蚀剂层的效率。
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公开(公告)号：US20100200397A1
公开(公告)日：2010-08-12
申请号：US12656683
申请日：2010-02-12
申请人： Yijung Kim , Eun Su Rho , Jeong Yong Bae
发明人： Yijung Kim , Eun Su Rho , Jeong Yong Bae
CPC分类号： C25D7/12 , C25D17/001 , H01L21/2885 , H01L21/76877
摘要： Provided are a substrate plating apparatus and a substrate plating method. In the substrate plating apparatus, a substrate support member supports a substrate to allow a plating surface to look up. A plating solution containing positive ions dissolved from a positive electrode is supplied from a plating solution supply member onto the substrate at an upper side of the substrate support member. A plating bath surrounds the substrate support member. The substrate support member is rotated in a state where it is immersed into the plating solution and an additive. The substrate can be supported by the substrate support member without reversing the substrate. Also, a pattern defect due to bubbles generated during a plating process can be prevented.
摘要翻译： 提供了基板电镀装置和基板电镀方法。 在基板电镀装置中，基板支撑部件支撑基板以允许电镀表面查找。 从正极溶解的含有正离子的电镀溶液从电镀溶液供给部件在基板支撑部件的上侧供给到基板上。 电镀浴围绕衬底支撑构件。 衬底支撑构件在浸入电镀溶液和添加剂的状态下旋转。 衬底可以由衬底支撑构件支撑，而不会反转衬底。 此外，可以防止由于在电镀工艺期间产生的气泡引起的图案缺陷。
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公开(公告)号：US08540854B2
公开(公告)日：2013-09-24
申请号：US12656683
申请日：2010-02-12
申请人： Yijung Kim , Eun Su Rho , Jeong Yong Bae
发明人： Yijung Kim , Eun Su Rho , Jeong Yong Bae
CPC分类号： C25D7/12 , C25D17/001 , H01L21/2885 , H01L21/76877
摘要： Provided are a substrate plating apparatus and a substrate plating method. In the substrate plating apparatus, a substrate support member supports a substrate to allow a plating surface to look up. A plating solution containing positive ions dissolved from a positive electrode is supplied from a plating solution supply member onto the substrate at an upper side of the substrate support member. A plating bath surrounds the substrate support member. The substrate support member is rotated in a state where it is immersed into the plating solution and an additive. The substrate can be supported by the substrate support member without reversing the substrate. Also, a pattern defect due to bubbles generated during a plating process can be prevented.
摘要翻译： 提供了基板电镀装置和基板电镀方法。 在基板电镀装置中，基板支撑部件支撑基板以允许电镀表面查找。 从正极溶解的含有正离子的电镀溶液从电镀溶液供给部件在基板支撑部件的上侧供给到基板上。 电镀浴围绕衬底支撑构件。 衬底支撑构件在浸入电镀溶液和添加剂的状态下旋转。 衬底可以由衬底支撑构件支撑，而不会反转衬底。 此外，可以防止由于在电镀工艺期间产生的气泡引起的图案缺陷。
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公开(公告)号：US09529267B2
公开(公告)日：2016-12-27
申请号：US13928446
申请日：2013-06-27
申请人： Eun-Su Rho , Jeong-Yong Bae
发明人： Eun-Su Rho , Jeong-Yong Bae
CPC分类号： G03F7/422 , G03F7/423 , H01L21/6708
摘要： A method for processing a substrate includes arranging the substrate on which a photoresist layer is formed and providing a treatment liquid for removing the photoresist layer on the substrate. The method also includes providing a mist including deionized water or hydrogen peroxide on the substrate to make contact with the treatment liquid so as to increase a temperature of the treatment liquid. Therefore, efficiency of removing the photoresist layer may be improved.
摘要翻译： 一种用于处理衬底的方法包括布置其上形成有光致抗蚀剂层的衬底，并提供用于去除衬底上的光致抗蚀剂层的处理液。 该方法还包括在基材上提供包含去离子水或过氧化氢的雾以与处理液体接触，从而提高处理液的温度。 因此，可以提高除去光致抗蚀剂层的效率。
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