A semiconductor sample is received on a chuck of a stage that is movable with respect to a stage frame. The stage, chuck, and sample are moved under an inspection or exposure head for inspecting or exposing the sample, and multiple 2D encoder heads are coupled with the chuck. Multiple 2D encoder scales are coupled with a base through which the head is inserted, and a stage encoder is positioned on the stage frame. Movement of the stage, chuck, and sample is controlled based on a position detected by at least one of the 2D encoder heads until a predefined position that is within a gap that is not covered by the 2D encoder scales is reached. Movement control of the stage, chuck, and sample is switched to being based on a position detected by the stage encoder when such predefined position that is within the gap is reached.