公开(公告)号：US20190385882A1

公开(公告)日：2019-12-19

申请号：US16152731

申请日：2018-10-05

Applicant: KLA-Tencor Corporation

Inventor： Aviv Balan ,  Haoran Jiang

IPC: H01L21/683 ,  H01L21/68

Abstract: An assembly for clamping semiconductor wafers includes a plate and an electrostatic chuck mounted on the plate. A plurality of slots extends between respective portions of the electrostatic chuck to receive arms of an end-effector of a wafer-handler. The arms of the end-effector support semiconductor wafers being placed onto and removed from the electrostatic chuck.

公开(公告)号：US20180108559A1

公开(公告)日：2018-04-19

申请号：US15383207

申请日：2016-12-19

Applicant: KLA-Tencor Corporation

Inventor： Aviv Balan ,  Luping Huang ,  Savita Chandan ,  Chia-Chu Chen ,  Teck Meriam

IPC: H01L21/683 ,  H01L21/687

Abstract: Methods and systems for vacuum mounting a warped, thin substrate onto a flat chuck are presented herein. A vacuum chuck includes three or more collapsible bellows that move above the chuck and into contact with a warped substrate. The bellows seal and vacuum clamp onto the backside surface of the substrate. In some embodiments, the bellows collapse by at least five hundred micrometers while clamping. An extensible sealing element is mounted in a recessed annular channel on the surface of the chuck body. As the substrate moves toward the chucking surface, the extensible sealing element extends at least five millimeters above the chuck body and into contact with the substrate. As the space between the chuck and the substrate is evacuated, the extensible sealing element collapse into the recessed annular channel, and the substrate is clamped onto the flat chucking surface of chuck body.

公开(公告)号：US10468288B2

公开(公告)日：2019-11-05

申请号：US15383207

申请日：2016-12-19

Applicant: KLA-Tencor Corporation

Inventor： Aviv Balan ,  Luping Huang ,  Savita Chandan ,  Chia-Chu Chen ,  Teck Meriam

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/67

Abstract: Methods and systems for vacuum mounting a warped, thin substrate onto a flat chuck are presented herein. A vacuum chuck includes three or more collapsible bellows that move above the chuck and into contact with a warped substrate. The bellows seal and vacuum clamp onto the backside surface of the substrate. In some embodiments, the bellows collapse by at least five hundred micrometers while clamping. An extensible sealing element is mounted in a recessed annular channel on the surface of the chuck body. As the substrate moves toward the chucking surface, the extensible sealing element extends at least five millimeters above the chuck body and into contact with the substrate. As the space between the chuck and the substrate is evacuated, the extensible sealing element collapse into the recessed annular channel, and the substrate is clamped onto the flat chucking surface of chuck body.

公开(公告)号：US10083852B1

公开(公告)日：2018-09-25

申请号：US15652659

申请日：2017-07-18

Applicant: KLA-Tencor Corporation

Inventor： Aviv Balan ,  Vaibhaw Vishal

IPC: H01L21/68 ,  H01L21/687 ,  H01L21/67

CPC classification number: H01L21/68721 ,  H01L21/67017 ,  H01L21/6838 ,  H01L21/68728 ,  H01L21/68735 ,  H01L21/68757

Abstract: Edge grippers are disposed around an outer edge of a chuck. Each of the edge grippers includes a finger configured to pivot around a point; a contact pad configured to contact the wafer; and a flexure disposed between the contact pad and the finger. The flexure is configured to flex toward and away from the chuck. The chuck can use a matrix of vacuum and pressure nozzles designed to keep a wafer floating above the chuck. The edge grippers can hold the wafer at the edge while minimizing deformation of the wafer or without affecting z-jitter of the wafer.

公开(公告)号：US20150160564A1

公开(公告)日：2015-06-11

申请号：US14559398

申请日：2014-12-03

Applicant: KLA-Tencor Corporation

Inventor： Aviv Balan

IPC: G03F7/20

CPC classification number: G03F7/70775

Abstract: A semiconductor sample is received on a chuck of a stage that is movable with respect to a stage frame. The stage, chuck, and sample are moved under an inspection or exposure head for inspecting or exposing the sample, and multiple 2D encoder heads are coupled with the chuck. Multiple 2D encoder scales are coupled with a base through which the head is inserted, and a stage encoder is positioned on the stage frame. Movement of the stage, chuck, and sample is controlled based on a position detected by at least one of the 2D encoder heads until a predefined position that is within a gap that is not covered by the 2D encoder scales is reached. Movement control of the stage, chuck, and sample is switched to being based on a position detected by the stage encoder when such predefined position that is within the gap is reached.

Abstract translation: 半导体样品被接收在能够相对于舞台框架移动的舞台的卡盘上。 舞台，卡盘和样品在检查或曝光头下移动以检查或暴露样品，并且多个2D编码器头与卡盘耦合。 多个2D编码器刻度与插入头部的基座相耦合，并且载台编码器位于平台框架上。 基于由至少一个2D编码器头检测的位置来控制舞台，卡盘和样本的移动，直到达到未被2D编码器缩放的间隙内的预定位置。 当到达间隙内的预定位置时，将舞台，卡盘和样品的移动控制切换到基于由舞台编码器检测到的位置。

公开(公告)号：US11121019B2

公开(公告)日：2021-09-14

申请号：US16152731

申请日：2018-10-05

Applicant: KLA-Tencor Corporation

Inventor： Aviv Balan ,  Haoran Jiang

IPC: H01L21/68 ,  H01L21/683

Abstract: An assembly for clamping semiconductor wafers includes a plate and an electrostatic chuck mounted on the plate. A plurality of slots extends between respective portions of the electrostatic chuck to receive arms of an end-effector of a wafer-handler. The arms of the end-effector support semiconductor wafers being placed onto and removed from the electrostatic chuck.

公开(公告)号：US09529280B2

公开(公告)日：2016-12-27

申请号：US14559398

申请日：2014-12-03

Applicant: KLA-Tencor Corporation

Inventor： Aviv Balan

IPC: G03B27/58 ,  G03B27/42 ,  G03F7/20

CPC classification number: G03F7/70775

Abstract: A semiconductor sample is received on a chuck of a stage that is movable with respect to a stage frame. The stage, chuck, and sample are moved under an inspection or exposure head for inspecting or exposing the sample, and multiple 2D encoder heads are coupled with the chuck. Multiple 2D encoder scales are coupled with a base through which the head is inserted, and a stage encoder is positioned on the stage frame. Movement of the stage, chuck, and sample is controlled based on a position detected by at least one of the 2D encoder heads until a predefined position that is within a gap that is not covered by the 2D encoder scales is reached. Movement control of the stage, chuck, and sample is switched to being based on a position detected by the stage encoder when such predefined position that is within the gap is reached.

Abstract translation: 半导体样品被接收在能够相对于舞台框架移动的舞台的卡盘上。 舞台，卡盘和样品在检查或曝光头下移动以检查或暴露样品，并且多个2D编码器头与卡盘耦合。 多个2D编码器刻度与插入头部的基座相耦合，并且载台编码器位于平台框架上。 基于由至少一个2D编码器头检测的位置来控制舞台，卡盘和样本的移动，直到达到未被2D编码器缩放的间隙内的预定位置。 当到达间隙内的预定位置时，将舞台，卡盘和样品的移动控制切换到基于由舞台编码器检测到的位置。