Invention Grant
- Patent Title: Chip resistor and method of producing the same
- Patent Title (中): 贴片电阻及其制造方法
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Application No.: US14368757Application Date: 2012-12-18
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Publication No.: US09530546B2Publication Date: 2016-12-27
- Inventor: Eiji Nukaga , Hiroshi Tamagawa , Yasuhiro Kondo , Katsuya Matsuura
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2011-289282 20111228; JP2012-015423 20120127; JP2012-015424 20120127; JP2012-015425 20120127; JP2012-039179 20120224; JP2012-039180 20120224; JP2012-269719 20121210
- International Application: PCT/JP2012/082725 WO 20121218
- International Announcement: WO2013/099688 WO 20130704
- Main IPC: H01C7/18
- IPC: H01C7/18 ; H01C7/00 ; H01C13/02 ; H01C17/06 ; H01C17/242 ; H01C17/00 ; H01G2/06

Abstract:
[Subject]To provide a chip resistor free from chipping of corner portions thereof and a method of producing the chip resistor.[Solution] The chip resistor (1) includes: a board (2) having a device formation surface (2A), a back surface (2B) opposite from the device formation surface (2A) and side surfaces (2C-2F) connecting the device formation surface (2A) to the back surface (2B), a resistor portion (56) provided on the device formation surface (2A), a first connection electrode (3) and a second connection electrode (4) provided on the device formation surface (2A) and electrically connected to the resistor portion (56), and a resin film (24) covering the device formation surface (2A) with the first connection electrode (3) and the second connection electrode (4) being exposed therefrom. Intersection portions (11) of the board (2) along which the back surface (2B) intersects the side surfaces (2C-2F) each have a rounded shape.
Public/Granted literature
- US20140354396A1 CHIP RESISTOR AND METHOD OF PRODUCING THE SAME Public/Granted day:2014-12-04
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