Invention Grant
US09530813B2 Seal ring structure with rounded corners for semiconductor devices
有权
用于半导体器件的具有圆角的密封环结构
- Patent Title: Seal ring structure with rounded corners for semiconductor devices
- Patent Title (中): 用于半导体器件的具有圆角的密封环结构
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Application No.: US14166878Application Date: 2014-01-29
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Publication No.: US09530813B2Publication Date: 2016-12-27
- Inventor: Volume Chien , Yun-Wei Cheng , I-l Cheng , Shiu-Ko Jangjian , Chi-Cherng Jeng , Hsin-Chi Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L23/00

Abstract:
Seal ring structures are provided with rounded corner junctions or corner junctions that include polygons. The seal rings surround generally rectangular semiconductor devices such as integrated circuits, image sensors and other devices. The seal ring includes a configuration of two sets of generally parallel opposed sides and the corner junctions are the junctions at which adjacent orthogonal seal ring sides are joined. The seal rings are trench structures or filled trench structures in various embodiments. The rounded corner junctions are formed by a curved arc or multiple line segments joined together at various angles. The corner junctions that include one or more enclosed polygons include polygons with at least one polygon side being formed by one of the seal ring sides.
Public/Granted literature
- US20140264710A1 SEAL RING STRUCTURE WITH ROUNDED CORNERS FOR SEMICONDUCTOR DEVICES Public/Granted day:2014-09-18
Information query
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