公开(公告)号：US09530813B2

公开(公告)日：2016-12-27

申请号：US14166878

申请日：2014-01-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Volume Chien ,  Yun-Wei Cheng ,  I-l Cheng ,  Shiu-Ko Jangjian ,  Chi-Cherng Jeng ,  Hsin-Chi Chen

IPC: H01L27/146 ,  H01L23/00

CPC classification number: H01L27/1464 ,  H01L23/562 ,  H01L27/14623 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Seal ring structures are provided with rounded corner junctions or corner junctions that include polygons. The seal rings surround generally rectangular semiconductor devices such as integrated circuits, image sensors and other devices. The seal ring includes a configuration of two sets of generally parallel opposed sides and the corner junctions are the junctions at which adjacent orthogonal seal ring sides are joined. The seal rings are trench structures or filled trench structures in various embodiments. The rounded corner junctions are formed by a curved arc or multiple line segments joined together at various angles. The corner junctions that include one or more enclosed polygons include polygons with at least one polygon side being formed by one of the seal ring sides.

Abstract translation: 密封环结构设有圆角拐角接头或角接头，包括多边形。 密封环围绕大体上矩形的半导体器件，例如集成电路，图像传感器和其它器件。 密封环包括两组大致平行的相对侧的构造，角接头是相邻的正交密封环侧连接的接合处。 在各种实施例中，密封环是沟槽结构或填充沟槽结构。 圆形的角接头由弯曲的弧形或以各种角度连接在一起的多个线段形成。 包括一个或多个封闭多边形的角接头包括多边形，其中至少一个多边形边由密封环侧之一形成。