Invention Grant
- Patent Title: Methods to introduce sub-micrometer, symmetry-breaking surface corrugation to silicon substrates to increase light trapping
- Patent Title (中): 将亚微米对称破裂的表面波纹引入硅衬底以增加光捕获的方法
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Application No.: US15030039Application Date: 2014-10-17
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Publication No.: US09530906B2Publication Date: 2016-12-27
- Inventor: Sang Eon Han , Brittany R. Hoard , Sang M. Han , Swapnadip Ghosh
- Applicant: STC.UNM
- Applicant Address: US NM Albuquerque
- Assignee: STC.UNM
- Current Assignee: STC.UNM
- Current Assignee Address: US NM Albuquerque
- Agency: MH2 Technology Law Group LLP
- International Application: PCT/US2014/061178 WO 20141017
- International Announcement: WO2015/058105 WO 20150423
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L31/0236 ; H01L31/0747 ; H01L31/20

Abstract:
Provided is a method for fabricating a nanopatterned surface. The method includes forming a mask on a substrate, patterning the substrate to include a plurality of symmetry-breaking surface corrugations, and removing the mask. The mask includes a pattern defined by mask material portions that cover first surface portions of the substrate and a plurality of mask space portions that expose second surface portions of the substrate, wherein the plurality of mask space portions are arranged in a lattice arrangement having a row and column, and the row is not oriented parallel to a [110] direction of the substrate. The patterning the substrate includes anisotropically removing portions of the substrate exposed by the plurality of spaces.
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