Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14625015Application Date: 2015-02-18
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Publication No.: US09536835B2Publication Date: 2017-01-03
- Inventor: Hyun-Seung Song , Hyeonuk Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP.
- Priority: KR10-2014-0081959 20140701
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L27/08 ; H01L23/535 ; H01L27/02 ; H01L27/092 ; H01L29/417 ; H01L27/088 ; H01L21/8234 ; H01L21/8238

Abstract:
A semiconductor device includes a first gate electrode provided in a jumper region of a substrate and extending in a first direction, first source/drain regions provided at both sides of the first gate electrode, and a connecting contact electrically connecting the first gate electrode and the first source/drain regions to each other. The connecting contact includes first sub-contacts disposed at both sides of the first gate electrode and connected to the first source/drain regions, and a second sub-contact extending in a second direction intersecting the first direction. The second sub-contact is connected to the first sub-contacts and is in contact with a top surface of the first gate electrode. In the first direction, each of the first sub-contacts has a first width and the second sub-contact has a second width smaller than the first width.
Public/Granted literature
- US20160005851A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2016-01-07
Information query
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