Invention Grant
- Patent Title: Semiconductor light emitting device package
- Patent Title (中): 半导体发光器件封装
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Application No.: US14154902Application Date: 2014-01-14
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Publication No.: US09537060B2Publication Date: 2017-01-03
- Inventor: Chang Bun Yoon , Sang Hyun Kim , Min Jung Park , Jeong Rok Oh , Chul Soo Yoon
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2013-0028184 20130315
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/50 ; H01L33/46
Abstract:
A semiconductor light emitting device package includes: a light emitting device; a wavelength conversion unit formed in a path of light emitted from the light emitting device and including a mixture of a wavelength conversion material and a glass material; and a reflective film disposed on an upper surface of the wavelength conversion unit and reflecting a partial amount of light emitted from the light emitting device and allowing a partial amount of light emitted from the light emitting device to be transmitted therethrough.
Public/Granted literature
- US20140264412A1 SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2014-09-18
Information query
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