公开(公告)号：US08748847B2

公开(公告)日：2014-06-10

申请号：US13723855

申请日：2012-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong Rak Sohn ,  Seul Gee Lee ,  Chul Soo Yoon ,  Chang Bun Yoon ,  Min Jung Park ,  Sang Hoon Ahn

IPC: G01N21/64

CPC classification number: H01L22/20 ,  G01J1/0488 ,  G01J3/0251 ,  G01J2001/4252 ,  G01N21/64 ,  H01L22/14 ,  H01L33/005 ,  H01L33/56 ,  H01L2933/0041

Abstract: A method of manufacturing a white light emitting device includes dividing a phosphor sheet into phosphor film units to be applied to individual light emitting diode (LED) devices, measuring light conversion characteristics of the respective phosphor film units, classifying the phosphor film units of the phosphor sheet into a plurality of groups according to measurement results of the light conversion characteristics and combining the phosphor film units classified into the plurality of groups and an LED device having predetermined light characteristics so as to obtain target color characteristics.

Abstract translation: 一种白色发光器件的制造方法，其特征在于，将荧光体片分割为单独的发光二极管（LED）器件的荧光膜单元，测定各荧光膜单元的光转换特性，对荧光体膜的荧光体单元进行分类 根据光转换特性的测量结果将多个组分成多组，并组合分成多组的荧光膜单元和具有预定光特性的LED装置，以获得目标色特性。

公开(公告)号：US20140227806A1

公开(公告)日：2014-08-14

申请号：US14257219

申请日：2014-04-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JONG RAK SOHN ,  Seul Gee Lee ,  Chul Soo Yoon ,  Chang Bun Yoon ,  Min Jung Park ,  Sang Hoon Ahn

IPC: H01L21/66 ,  H01L33/56

CPC classification number: H01L22/20 ,  G01J1/0488 ,  G01J3/0251 ,  G01J2001/4252 ,  G01N21/64 ,  H01L22/14 ,  H01L33/005 ,  H01L33/56 ,  H01L2933/0041

Abstract: A method of manufacturing a white light emitting device includes dividing a phosphor sheet into phosphor film units to be applied to individual light emitting diode (LED) devices, measuring light conversion characteristics of the respective phosphor film units, classifying the phosphor film units of the phosphor sheet into a plurality of groups according to measurement results of the light conversion characteristics and combining the phosphor film units classified into the plurality of groups and an LED device having predetermined light characteristics so as to obtain target color characteristics.

Abstract translation: 一种白色发光器件的制造方法，其特征在于，将荧光体片分割为单独的发光二极管（LED）器件的荧光膜单元，测定各荧光膜单元的光转换特性，对荧光体膜的荧光体单元进行分类 根据光转换特性的测量结果将多个组分成多组，并组合分成多组的荧光膜单元和具有预定光特性的LED装置，以获得目标色特性。

公开(公告)号：US09735331B2

公开(公告)日：2017-08-15

申请号：US15238282

申请日：2016-08-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soo Moon Park ,  Il Woo Park ,  Mi Hwa Yu ,  Chang Bun Yoon

IPC: H01L33/62 ,  H01L23/00 ,  H01L33/06 ,  H01L33/14 ,  H01L33/32 ,  H01L33/42 ,  H01L33/46 ,  H01L33/54 ,  H01L33/50 ,  H01L25/075 ,  H05B37/02 ,  F21V8/00 ,  F21V23/02 ,  F21V19/00 ,  F21V29/77

CPC classification number: H01L33/62 ,  F21V19/006 ,  F21V23/02 ,  F21V29/77 ,  G02B6/0031 ,  G02B6/0073 ,  G02B6/0083 ,  H01L24/45 ,  H01L25/0753 ,  H01L33/06 ,  H01L33/145 ,  H01L33/32 ,  H01L33/42 ,  H01L33/46 ,  H01L33/502 ,  H01L33/54 ,  H01L2224/45139 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/181 ,  H05B33/0803 ,  H05B37/0272 ,  H01L2924/00014

Abstract: Provided is a bonding wire for a semiconductor package and a semiconductor package including the same. The bonding wire for the semiconductor package may include a core portion including silver (Ag), and a shell layer surrounding the core portion, having a thickness of 2 nm to 23 nm, and including gold (Au). The semiconductor package may include a package body having a first electrode structure and a second electrode structure, a semiconductor light emitting device comprising a first electrode portion and a second electrode portion electrically connected to the first electrode structure and the second electrode structure, and a bonding wire connecting at least one of the first electrode structure and the second electrode structure to the semiconductor light emitting device.

公开(公告)号：US09048172B2

公开(公告)日：2015-06-02

申请号：US14257219

申请日：2014-04-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong Rak Sohn ,  Seul Gee Lee ,  Chul Soo Yoon ,  Chang Bun Yoon ,  Min Jung Park ,  Sang Hoon Ahn

IPC: G01N21/64 ,  H01L21/66 ,  H01L33/00 ,  H01L33/56 ,  G01J1/04 ,  G01J1/42 ,  G01J3/02

CPC classification number: H01L22/20 ,  G01J1/0488 ,  G01J3/0251 ,  G01J2001/4252 ,  G01N21/64 ,  H01L22/14 ,  H01L33/005 ,  H01L33/56 ,  H01L2933/0041

Abstract: A method of manufacturing a white light emitting device includes dividing a phosphor sheet into phosphor film units to be applied to individual light emitting diode (LED) devices, measuring light conversion characteristics of the respective phosphor film units, classifying the phosphor film units of the phosphor sheet into a plurality of groups according to measurement results of the light conversion characteristics and combining the phosphor film units classified into the plurality of groups and an LED device having predetermined light characteristics so as to obtain target color characteristics.

Abstract translation: 一种白色发光器件的制造方法，其特征在于，将荧光体片分割为单独的发光二极管（LED）器件的荧光膜单元，测定各荧光膜单元的光转换特性，对荧光体膜的荧光体单元进行分类 根据光转换特性的测量结果将多个组分成多组，并组合分成多组的荧光膜单元和具有预定光特性的LED装置，以获得目标色特性。

公开(公告)号：US09537060B2

公开(公告)日：2017-01-03

申请号：US14154902

申请日：2014-01-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chang Bun Yoon ,  Sang Hyun Kim ,  Min Jung Park ,  Jeong Rok Oh ,  Chul Soo Yoon

IPC: H01L33/00 ,  H01L33/50 ,  H01L33/46

CPC classification number: H01L33/504 ,  H01L33/46 ,  H01L33/50 ,  H01L33/501 ,  H01L33/502 ,  H01L33/507 ,  H01L2224/32245

Abstract: A semiconductor light emitting device package includes: a light emitting device; a wavelength conversion unit formed in a path of light emitted from the light emitting device and including a mixture of a wavelength conversion material and a glass material; and a reflective film disposed on an upper surface of the wavelength conversion unit and reflecting a partial amount of light emitted from the light emitting device and allowing a partial amount of light emitted from the light emitting device to be transmitted therethrough.

Abstract translation: 一种半导体发光器件封装，包括：发光器件; 波长转换单元，其形成在从所述发光器件发射的光的路径中，并且包括波长转换材料和玻璃材料的混合物; 以及反射膜，其设置在所述波长转换单元的上表面上，并且反射从所述发光器件发射的部分光量，并允许从所述发光器件发射的部分光量透射通过。