Invention Grant
- Patent Title: Package structure and fabrication method thereof
- Patent Title (中): 封装结构及其制造方法
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Application No.: US14631892Application Date: 2015-02-26
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Publication No.: US09542598B2Publication Date: 2017-01-10
- Inventor: Wen-Yu Teng , Liang-Yi Hung
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW103142973A 20141210
- Main IPC: G06K9/00
- IPC: G06K9/00 ; H01L23/00 ; H01L23/29 ; H01L21/78 ; H01L21/56
Abstract:
A method for fabricating a package structure is provided, including the steps of: disposing and electrically connecting a sensing chip to a substrate; forming an encapsulant on the substrate to encapsulate the sensing chip; and forming a bright layer on the encapsulant to increase the gloss of the package structure. The encapsulant includes an additive to increase the Mohs hardness of the encapsulant. Further, the encapsulant with different additives presents different colors. Therefore, the invention obtains a high-gloss, high-hardness and colorful sensor package structure.
Public/Granted literature
- US20160172264A1 PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF Public/Granted day:2016-06-16
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