公开(公告)号：US20160172264A1

公开(公告)日：2016-06-16

申请号：US14631892

申请日：2015-02-26

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Wen-Yu Teng ,  Liang-Yi Hung

IPC: H01L23/31 ,  H01L21/56 ,  G06K9/00 ,  H01L23/495 ,  H01L23/00 ,  H01L23/29 ,  H01L21/78

CPC classification number: G06K9/0053 ,  G06K9/0002 ,  G06K9/0004 ,  H01L21/561 ,  H01L21/566 ,  H01L21/78 ,  H01L23/295 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: A method for fabricating a package structure is provided, including the steps of: disposing and electrically connecting a sensing chip to a substrate; forming an encapsulant on the substrate to encapsulate the sensing chip; and forming a bright layer on the encapsulant to increase the gloss of the package structure. The encapsulant includes an additive to increase the Mohs hardness of the encapsulant. Further, the encapsulant with different additives presents different colors. Therefore, the invention obtains a high-gloss, high-hardness and colorful sensor package structure.

Abstract translation: 提供了一种制造封装结构的方法，包括以下步骤：将感测芯片布置并电连接到基板; 在衬底上形成密封剂以封装感测芯片; 并在密封剂上形成光亮层以增加封装结构的光泽度。 密封剂包括添加剂以增加密封剂的莫氏硬度。 此外，具有不同添加剂的密封剂呈现不同的颜色。 因此，本发明获得了高光泽，高硬度和彩色的传感器封装结构。

公开(公告)号：US09542598B2

公开(公告)日：2017-01-10

申请号：US14631892

申请日：2015-02-26

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Wen-Yu Teng ,  Liang-Yi Hung

IPC: G06K9/00 ,  H01L23/00 ,  H01L23/29 ,  H01L21/78 ,  H01L21/56

CPC classification number: G06K9/0053 ,  G06K9/0002 ,  G06K9/0004 ,  H01L21/561 ,  H01L21/566 ,  H01L21/78 ,  H01L23/295 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: A method for fabricating a package structure is provided, including the steps of: disposing and electrically connecting a sensing chip to a substrate; forming an encapsulant on the substrate to encapsulate the sensing chip; and forming a bright layer on the encapsulant to increase the gloss of the package structure. The encapsulant includes an additive to increase the Mohs hardness of the encapsulant. Further, the encapsulant with different additives presents different colors. Therefore, the invention obtains a high-gloss, high-hardness and colorful sensor package structure.

Abstract translation: 提供了一种制造封装结构的方法，包括以下步骤：将感测芯片布置并电连接到基板; 在衬底上形成密封剂以封装感测芯片; 并在密封剂上形成光亮层以增加封装结构的光泽度。 密封剂包括添加剂以增加密封剂的莫氏硬度。 此外，具有不同添加剂的密封剂呈现不同的颜色。 因此，本发明获得了高光泽，高硬度和彩色的传感器封装结构。