Invention Grant
- Patent Title: Packaging process tools and systems, and packaging methods for semiconductor devices
- Patent Title (中): 包装工艺和系统以及半导体器件的封装方法
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Application No.: US13309311Application Date: 2011-12-01
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Publication No.: US09543185B2Publication Date: 2017-01-10
- Inventor: Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chun-Cheng Lin , Ming-Da Cheng , Chung-Shi Liu
- Applicant: Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chun-Cheng Lin , Ming-Da Cheng , Chung-Shi Liu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: B23Q3/00
- IPC: B23Q3/00 ; H01L21/683 ; H01L23/31 ; H01L23/00 ; H01L21/56
Abstract:
Packaging process tools and systems, and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure for supporting package substrates or integrated circuit die during a packaging process for the integrated circuit die. The mechanical structure includes a low thermal conductivity material disposed thereon.
Public/Granted literature
- US20130143361A1 Packaging Process Tools and Systems, and Packaging Methods for Semiconductor Devices Public/Granted day:2013-06-06
Information query
IPC分类:
