发明授权
- 专利标题： Packaging process tools and systems, and packaging methods for semiconductor devices
- 专利标题（中）： 包装工艺和系统以及半导体器件的封装方法
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申请号： US13309311申请日： 2011-12-01
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公开(公告)号： US09543185B2公开(公告)日： 2017-01-10
- 发明人: Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chun-Cheng Lin , Ming-Da Cheng , Chung-Shi Liu
- 申请人： Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chun-Cheng Lin , Ming-Da Cheng , Chung-Shi Liu
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater Matsil, LLP
- 主分类号： B23Q3/00
- IPC分类号： B23Q3/00 ; H01L21/683 ; H01L23/31 ; H01L23/00 ; H01L21/56
摘要：
Packaging process tools and systems, and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure for supporting package substrates or integrated circuit die during a packaging process for the integrated circuit die. The mechanical structure includes a low thermal conductivity material disposed thereon.
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