Invention Grant
- Patent Title: Wafer die separation
- Patent Title (中): 晶圆分离
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Application No.: US14985705Application Date: 2015-12-31
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Publication No.: US09543206B2Publication Date: 2017-01-10
- Inventor: Genki Yano
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Charles A. Brill; Frank D. Cimino
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/78 ; H01L21/687 ; H01L21/683 ; H01L21/67
Abstract:
A method of singulating a wafer starts with fracturing the wafer. The method may also include attaching the dicing tape sheet to a ring frame; relatively raising a portion of the dicing tape sheet supporting the wafer with respect to the ring frame; and attaching support tape to the ring frame and the dicing tape sheet.
Public/Granted literature
- US20160118300A1 WAFER DIE SEPARATION Public/Granted day:2016-04-28
Information query
IPC分类:
