A power supply system has a leadframe with leads and a pad. The pad surface facing a circuit board has a portion recessed with a depth and an outline suitable for attaching side-by-side the sync and the control FET semiconductor chips. The input terminal of the control FET and the grounded output terminal of the sync FET are coplanar with the un-recessed portion of the pad (switch node terminal) so that all terminals can be directly attached to contacts of a circuit board. A driver-and-control chip is vertically stacked to the opposite pad surface and encapsulated in a packaging compound.