Invention Grant
US09543274B2 Semiconductor device packages with improved thermal management and related methods
有权
具有改进热管理和相关方法的半导体器件封装
- Patent Title: Semiconductor device packages with improved thermal management and related methods
- Patent Title (中): 具有改进热管理和相关方法的半导体器件封装
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Application No.: US14605466Application Date: 2015-01-26
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Publication No.: US09543274B2Publication Date: 2017-01-10
- Inventor: Steven Groothuis , Jian Li , Shijian Luo
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/02 ; H01L25/065 ; H01L23/48 ; H01L21/56 ; H01L23/13

Abstract:
Semiconductor device packages in accordance with this disclosure may include a substrate and a stack of semiconductor dice attached to the substrate. The stack of semiconductor dice may include vias extending through each semiconductor die of the stack for electrically interconnecting the semiconductor dice in the stack to one another and to the substrate. Another semiconductor die may be electrically connected to the stack of semiconductor dice and may be located on a side of the stack of semiconductor dice opposing the substrate. The other semiconductor die may be a heat-generating component configured to generate more heat than each semiconductor die of the stack of semiconductor dice. Electrical connectors may be located laterally adjacent to the vias and may form electrical connections between the substrate and the other semiconductor die in isolation from integrated circuitry of the semiconductor dice in the stack.
Public/Granted literature
- US20160218085A1 SEMICONDUCTOR DEVICE PACKAGES WITH IMPROVED THERMAL MANAGEMENT AND RELATED METHODS Public/Granted day:2016-07-28
Information query
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