发明授权
- 专利标题： Reduced expansion thermal compression bonding process bond head
- 专利标题（中）： 减少膨胀热压接工艺粘结头
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申请号： US14132812申请日： 2013-12-18
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公开(公告)号： US09548284B2公开(公告)日： 2017-01-17
- 发明人: Pramod Malatkar , Hemanth Dhavaleswarapu , James Neeb
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Schwegman Lundberg & Woessner, P.A.
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/603 ; B29L31/34
摘要：
Embodiments of a thermal compression bonding process bond head and a method for producing a thermal compression bonding process bond head are disclosed. In some embodiments, the bond head includes a thermal compression bonding process heater and a cooling block coupled to the heater through an annular structure. The annular structure surrounds a lower portion of the cooling block and couples the cooling block to the heater such that there is no direct mechanical contact between the cooling block and the heater.
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