公开(公告)号：US09748199B2

公开(公告)日：2017-08-29

申请号：US15062298

申请日：2016-03-07

Applicant: Intel Corporation

Inventor： Hemanth Dhavaleswarapu ,  Zhihua Li ,  Joseph Petrini ,  Steven B. Roach ,  Shankar Devasenathipathy ,  George Kostiew ,  Amram Eitan

IPC: B23K31/02 ,  H01L23/00 ,  H05K3/34 ,  B23K1/00 ,  B23K3/04 ,  B23K37/00 ,  B23K3/08 ,  B23K20/02 ,  B23K20/00 ,  B23K20/26 ,  B23K35/02 ,  B23K101/42 ,  B33Y80/00

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K3/04 ,  B23K3/08 ,  B23K3/085 ,  B23K20/002 ,  B23K20/023 ,  B23K20/026 ,  B23K20/26 ,  B23K35/0244 ,  B23K37/003 ,  B23K2101/42 ,  B33Y80/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/75102 ,  H01L2224/75252 ,  H01L2224/75266 ,  H01L2224/75301 ,  H01L2224/75502 ,  H01L2224/7555 ,  H01L2224/81097 ,  H01L2224/81098 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/81948 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2203/04 ,  H05K2203/1121 ,  H01L2924/014 ,  H01L2924/00012

Abstract: Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.

公开(公告)号：US20160211238A1

公开(公告)日：2016-07-21

申请号：US15062298

申请日：2016-03-07

Applicant: Intel Corporation

Inventor： Hemanth Dhavaleswarapu ,  Zhihua Li ,  Joseph Petrini ,  Steven B. Roach ,  Shankar Devasenathipathy ,  George S. Kostiew ,  Amram Eitan

IPC: H01L23/00 ,  B23K20/00 ,  B23K35/02 ,  B23K20/02 ,  B23K20/26

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K3/04 ,  B23K3/08 ,  B23K3/085 ,  B23K20/002 ,  B23K20/023 ,  B23K20/026 ,  B23K20/26 ,  B23K35/0244 ,  B23K37/003 ,  B23K2101/42 ,  B33Y80/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/75102 ,  H01L2224/75252 ,  H01L2224/75266 ,  H01L2224/75301 ,  H01L2224/75502 ,  H01L2224/7555 ,  H01L2224/81097 ,  H01L2224/81098 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/81948 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2203/04 ,  H05K2203/1121 ,  H01L2924/014 ,  H01L2924/00012

Abstract: Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.

公开(公告)号：US20190006259A1

公开(公告)日：2019-01-03

申请号：US15637107

申请日：2017-06-29

Applicant: Intel Corporation

Inventor： Dinesh Padmanabhan Ramalekshmi Thanu ,  Wei Hu ,  James C. Matayabas, JR. ,  Baris Bicen ,  Luke J. Garner ,  Hemanth Dhavaleswarapu

IPC: H01L23/367 ,  H01L25/065 ,  H01L23/00

Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures formed herein may include a first die disposed on a substrate and a second die disposed adjacent the first die on the substrate. A cooling solution is attached to the substrate, wherein a rib extends from a central region of the cooling solution and is attached to the substrate. The rib is disposed between the first die and the second die.

公开(公告)号：US20150171047A1

公开(公告)日：2015-06-18

申请号：US14132812

申请日：2013-12-18

Applicant: Intel Corporation

Inventor： Pramod Malatkar ,  Hemanth Dhavaleswarapu ,  James Neeb

IPC: H01L23/00 ,  B29C65/18

CPC classification number: H01L24/75 ,  B29L2031/34 ,  B29L2031/3425 ,  H01L2021/603 ,  H01L2224/75102 ,  H01L2224/75252 ,  H01L2224/75266 ,  H01L2224/75301 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/01008 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/0104 ,  H01L2924/01074 ,  H01L2924/0474 ,  H01L2924/0489 ,  H01L2924/04894 ,  H01L2924/05032 ,  H01L2924/0549 ,  Y10T29/49826

Abstract: Embodiments of a thermal compression bonding process bond head and a method for producing a thermal compression bonding process bond head are disclosed. In some embodiments, the bond head includes a thermal compression bonding process heater and a cooling block coupled to the heater through an annular structure. The annular structure surrounds a lower portion of the cooling block and couples the cooling block to the heater such that there is no direct mechanical contact between the cooling block and the heater.

Abstract translation: 公开了热压接工艺粘结头的实施例和用于制造热压接工艺粘合头的方法。 在一些实施例中，接合头包括热压接工艺加热器和通过环形结构联接到加热器的冷却块。 环形结构围绕冷却块的下部并且将冷却块连接到加热器，使得冷却块和加热器之间不存在直接的机械接触。

公开(公告)号：US09548284B2

公开(公告)日：2017-01-17

申请号：US14132812

申请日：2013-12-18

Applicant: Intel Corporation

Inventor： Pramod Malatkar ,  Hemanth Dhavaleswarapu ,  James Neeb

IPC: H01L23/00 ,  H01L21/603 ,  B29L31/34

CPC classification number: H01L24/75 ,  B29L2031/34 ,  B29L2031/3425 ,  H01L2021/603 ,  H01L2224/75102 ,  H01L2224/75252 ,  H01L2224/75266 ,  H01L2224/75301 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/01008 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/0104 ,  H01L2924/01074 ,  H01L2924/0474 ,  H01L2924/0489 ,  H01L2924/04894 ,  H01L2924/05032 ,  H01L2924/0549 ,  Y10T29/49826

Abstract: Embodiments of a thermal compression bonding process bond head and a method for producing a thermal compression bonding process bond head are disclosed. In some embodiments, the bond head includes a thermal compression bonding process heater and a cooling block coupled to the heater through an annular structure. The annular structure surrounds a lower portion of the cooling block and couples the cooling block to the heater such that there is no direct mechanical contact between the cooling block and the heater.

Abstract translation: 公开了热压接工艺粘结头的实施例和用于制造热压接工艺粘合头的方法。 在一些实施例中，接合头包括热压接工艺加热器和通过环形结构联接到加热器的冷却块。 环形结构围绕冷却块的下部并且将冷却块连接到加热器，使得冷却块和加热器之间不存在直接的机械接触。

公开(公告)号：US09282650B2

公开(公告)日：2016-03-08

申请号：US14132883

申请日：2013-12-18

Applicant: Intel Corporation

Inventor： Hemanth Dhavaleswarapu ,  Zhihua Li ,  Joseph Petrini ,  Steven B. Roach ,  Shankar Devasenathipathy ,  George Kostiew ,  Amram Eitan

IPC: B23K37/00 ,  H05K3/34 ,  B23K1/00 ,  B23K3/04 ,  H01L23/00 ,  B23K3/08 ,  B23K20/02

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K3/04 ,  B23K3/08 ,  B23K3/085 ,  B23K20/002 ,  B23K20/023 ,  B23K20/026 ,  B23K20/26 ,  B23K35/0244 ,  B23K37/003 ,  B23K2101/42 ,  B33Y80/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/75102 ,  H01L2224/75252 ,  H01L2224/75266 ,  H01L2224/75301 ,  H01L2224/75502 ,  H01L2224/7555 ,  H01L2224/81097 ,  H01L2224/81098 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/81948 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2203/04 ,  H05K2203/1121 ,  H01L2924/014 ,  H01L2924/00012

Abstract: Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.

Abstract translation: 公开了热压接（TCB）工艺冷却歧管，TCB工艺系统和使用冷却歧管的TCB方法的实施例。 在一些实施例中，冷却歧管包括通过挡板与混合室分离的预混合室。 挡板可以包括通过挡板形成的至少一个同心图案，使得预混合室中的主要冷却流体基本均匀地分布到混合室。 预混合室可以连接到主冷却流体源。 混合室可以具有被配置为接受主冷却流体的输入和输出以输出主冷却流体的输入。