Invention Grant
- Patent Title: Semiconductor devices and methods of forming the same
- Patent Title (中): 半导体器件及其形成方法
-
Application No.: US14969702Application Date: 2015-12-15
-
Publication No.: US09548389B2Publication Date: 2017-01-17
- Inventor: Donghyun Roh , Pankwi Park , Dongsuk Shin , Chulwoong Lee , Naein Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP
- Priority: KR10-2012-0105406 20120921
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/336 ; H01L21/8238 ; H01L29/78 ; H01L29/66 ; H01L21/8234 ; H01L29/161 ; H01L29/165

Abstract:
According to embodiments of the inventive concept, a gate electrode is formed on a substrate, and a first spacer, a second spacer, and a third spacer are sequentially formed on a sidewall of the gate electrode. The substrate is etched to form a recess region. A compressive stress pattern is formed in the recess region. A protective spacer is formed on a sidewall of the third spacer. When the recess region is formed, a lower portion of the second spacer is removed to form a gap region between the first and third spacers. The protective spacer fills the gap region.
Public/Granted literature
- US20160111538A1 SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME Public/Granted day:2016-04-21
Information query
IPC分类: