Invention Grant
- Patent Title: Apparatus and method for improved control of heating and cooling of substrates
- Patent Title (中): 改善基板加热和冷却控制的装置和方法
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Application No.: US14012473Application Date: 2013-08-28
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Publication No.: US09552989B2Publication Date: 2017-01-24
- Inventor: Blake R. Koelmel , Norman L. Tam , Joseph M. Ranish
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: F21V9/00
- IPC: F21V9/00 ; F26B19/00 ; H01L21/263 ; H01L21/67
Abstract:
Methods and apparatus for processing substrates and controlling the heating and cooling of substrates are described. A radiation source providing radiation in a first range of wavelengths heats the substrate within a predetermined temperature range, the substrate being absorptive of radiation in a second range of wavelengths within the first range of wavelengths and within the predetermined temperature rang. A filter prevents at least a portion of radiation within the second wavelength range from reaching the substrate.
Public/Granted literature
- US20140004716A1 Apparatus and Method for Improved Control of Heating and Cooling of Substrates Public/Granted day:2014-01-02
Information query
