Invention Grant
- Patent Title: Foam core chassis
- Patent Title (中): 泡沫核心机箱
-
Application No.: US13728829Application Date: 2012-12-27
-
Publication No.: US09555597B2Publication Date: 2017-01-31
- Inventor: Mark E. Sprenger , Paul J. Gwin
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: B32B5/18
- IPC: B32B5/18 ; B32B3/04 ; G06F1/16 ; B32B15/04 ; B32B27/06
Abstract:
An apparatus and computing device are described herein. The apparatus includes a chassis cover of a computing device. The apparatus also includes a foam core. Furthermore, the foam core is in contact with a surface of the chassis cover of the computing device.
Public/Granted literature
- US20140184043A1 FOAM CORE CHASSIS Public/Granted day:2014-07-03
Information query
