Invention Grant
US09556017B2 Apparatus and method for preventing stiction of MEMS devices encapsulated by active circuitry
有权
用于防止由有源电路封装的MEMS器件的静电的装置和方法
- Patent Title: Apparatus and method for preventing stiction of MEMS devices encapsulated by active circuitry
- Patent Title (中): 用于防止由有源电路封装的MEMS器件的静电的装置和方法
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Application No.: US13926257Application Date: 2013-06-25
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Publication No.: US09556017B2Publication Date: 2017-01-31
- Inventor: Li Chen , Thomas Kieran Nunan , Kuang L. Yang
- Applicant: Analog Devices, Inc.
- Applicant Address: US MA Norwood
- Assignee: Analog Devices, Inc.
- Current Assignee: Analog Devices, Inc.
- Current Assignee Address: US MA Norwood
- Agency: Sunstein Kann Murphy & Timbers LLP
- Main IPC: B81B3/00
- IPC: B81B3/00 ; B81C1/00
Abstract:
One or more stopper features (e.g., bump structures) are formed in a standard ASIC wafer top passivation layer for preventing MEMS device stiction vertically in integrated devices having a MEMS device capped directly by an ASIC wafer. A TiN coating may be used on the stopper feature(s) for anti-stiction. An electrical potential may be applied to the TiN anti-stiction coating of one or more stopper features.
Public/Granted literature
- US20140374856A1 Apparatus and Method for Preventing Stiction of MEMS Devices Encapsulated by Active Circuitry Public/Granted day:2014-12-25
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