Invention Grant
- Patent Title: Dual-pump formation fracturing
- Patent Title (中): 双泵地层压裂
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Application No.: US13708600Application Date: 2012-12-07
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Publication No.: US09556721B2Publication Date: 2017-01-31
- Inventor: In Chul Jang , Mark Milkovisch
- Applicant: Schlumberger Technology Corporation
- Applicant Address: US TX Sugar Land
- Assignee: SCHLUMBERGER TECHNOLOGY CORPORATION
- Current Assignee: SCHLUMBERGER TECHNOLOGY CORPORATION
- Current Assignee Address: US TX Sugar Land
- Agent Michael Dae
- Main IPC: E21B43/26
- IPC: E21B43/26 ; E21B43/00 ; E21B47/06 ; E21B49/08

Abstract:
Methods comprising conveying a downhole tool within a wellbore penetrating a subterranean formation, wherein the downhole tool comprises a first pump and a second pump, and wherein at least one operational capability of the first and second pumps is substantially different. A fracture is initiated in the subterranean formation by pumping fluid into the formation using the first pump. The fracture is propagated in the subterranean formation by pumping fluid into the formation using the second pump.
Public/Granted literature
- US20140158345A1 DUAL-PUMP FORMATION FRACTURING Public/Granted day:2014-06-12
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