Invention Grant
US09557639B2 Method of patterning block copolymer layer and patterned structure
有权
图案化嵌段共聚物层和图案结构的方法
- Patent Title: Method of patterning block copolymer layer and patterned structure
- Patent Title (中): 图案化嵌段共聚物层和图案结构的方法
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Application No.: US14078921Application Date: 2013-11-13
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Publication No.: US09557639B2Publication Date: 2017-01-31
- Inventor: Mi-Jeong Kim , In Taek Han , June Huh , Seong-Jun Jeong , Haeng Deog Koh , Youn Jung Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD. , Yonsei University, University—Industry Foundation(UIF)
- Applicant Address: KR Gyeonggi-Do KR Seoul
- Assignee: SAMSUNG ELECTRONICS CO., LTD.,YONSEI UNIVESITY, UNIVERSITY-INDUSTRY FOUNDATION(UIF)
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.,YONSEI UNIVESITY, UNIVERSITY-INDUSTRY FOUNDATION(UIF)
- Current Assignee Address: KR Gyeonggi-Do KR Seoul
- Agency: Cantor Colburn LLP
- Priority: KR10-2013-0002220 20130108
- Main IPC: G03F7/00
- IPC: G03F7/00 ; B82B3/00 ; B82Y40/00 ; B82Y30/00

Abstract:
A method of patterning a block copolymer layer, the method including: providing a substrate with a guide pattern formed on a surface thereof; forming a block copolymer layer on the substrate with the guide pattern, the block copolymer layer including a block copolymer; and directing self-assembly of the block copolymer on the substrate according to the guide pattern to form n/2 discrete domains, wherein the guide pattern includes a block copolymer patterning area having a 90-degree bending portion, and an outer apex and an inner apex of the 90-degree bending portion are each rounded, the outer apex having a first curvature radius r1, and the inner apex having a second curvature radius r2, respectively, and the width of the patterning area W, the first curvature radius r1 and the second curvature radius r2, satisfy Inequation 1: 2 + 2 - ( 1 + 2 ) [ ( n + 2 ) 2 n ( n + 1 ) ] 1 3 ≤ r 1 - r 2 W ≤ 2 + 2 - ( 1 + 2 ) [ ( n - 2 ) 2 n ( n - 1 ) ] 1 3 . Inequation 1
Public/Granted literature
- US20140193614A1 METHOD OF PATTERNING BLOCK COPOLYMER LAYER AND PATTERNED STRUCTURE Public/Granted day:2014-07-10
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