Invention Grant
US09559093B2 Method of forming a semiconductor device having a GaNFET, an overvoltage clamping component, and a voltage dropping component 有权
形成具有GaNFET的半导体器件,过电压钳位元件和降压元件的方法

Method of forming a semiconductor device having a GaNFET, an overvoltage clamping component, and a voltage dropping component
Abstract:
A method of forming a semiconductor device includes a GaN FET with an overvoltage clamping component electrically coupled to a drain node of the GaN FET and coupled in series to a voltage dropping component. The voltage dropping component is electrically coupled to a terminal which provides an off-state bias for the GaN FET. The overvoltage clamping component has a breakdown voltage less than a breakdown voltage of the GaN FET. The voltage dropping component is formed to provide a voltage drop which increases as current from the overvoltage clamping component increases. The semiconductor device is configured to turn on the GaN FET when the voltage drop across the voltage dropping component reaches a threshold value.
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