Invention Grant
- Patent Title: Display device and method for manufacturing the same
- Patent Title (中): 显示装置及其制造方法
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Application No.: US15145246Application Date: 2016-05-03
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Publication No.: US09559316B2Publication Date: 2017-01-31
- Inventor: Shunpei Yamazaki , Masakatsu Ohno , Hiroki Adachi , Satoru Idojiri , Koichi Takeshima
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2013-249631 20131202; JP2013-256872 20131212; JP2013-272176 20131227; JP2014-047348 20140311
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L51/00 ; H01L51/56 ; H01L51/52 ; H01L29/24 ; H01L29/66 ; H01L29/786 ; B23K26/04 ; B23K26/06 ; B23K26/08 ; H01L27/12 ; H01L51/50 ; H01L41/314 ; H01L27/32
Abstract:
A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
Public/Granted literature
- US20160247868A1 DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2016-08-25
Information query
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