Invention Grant
- Patent Title: Reduction of resonance in connectors
- Patent Title (中): 减少连接器中的谐振
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Application No.: US13903521Application Date: 2013-05-28
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Publication No.: US09560760B2Publication Date: 2017-01-31
- Inventor: Timothy D. Wig
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: International IP Law Group, P.L.L.C.
- Main IPC: H01R12/72
- IPC: H01R12/72 ; H05K1/11 ; H05K1/02 ; H05K3/36

Abstract:
Techniques for reducing resonance in contact fingers of a connector are described herein. An example of a device in accordance with the present techniques includes an add-in-card that includes a circuit board and an edge contact finger disposed on an outer surface of the circuit board. The add-in-card also includes a resonator disposed in an internal layer of the circuit board and coupled to the edge contact finger, wherein the resonator reduces a resonance in the edge contact finger.
Public/Granted literature
- US20140357105A1 REDUCTION OF RESONANCE IN CONNECTORS Public/Granted day:2014-12-04
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