Invention Grant
- Patent Title: Reduced trench profile for a gate
- Patent Title (中): 降低了门的沟槽轮廓
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Application No.: US14581741Application Date: 2014-12-23
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Publication No.: US09564501B2Publication Date: 2017-02-07
- Inventor: Qing Liu , Xiuyu Cai , Ruilong Xie , Chun-chen Yeh
- Applicant: STMICROELECTRONICS, INC. , GLOBALFOUNDRIES INC. , INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US TX Coppell KY Grand Cayman US NY Armonk
- Assignee: STMICROELECTRONICS, INC.,GLOBALFOUNDRIES INC.,INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: STMICROELECTRONICS, INC.,GLOBALFOUNDRIES INC.,INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US TX Coppell KY Grand Cayman US NY Armonk
- Agency: Seed IP Law Group LLP
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/423 ; H01L29/78 ; H01L29/66 ; H01L29/40

Abstract:
The present disclosure is directed to a gate structure for a transistor. The gate structure is formed on a substrate and includes a trench. There are sidewalls that line the trench. The sidewalls have a first dimension at a lower end of the trench and a second dimension at an upper end of the trench. The first dimension being larger than the second dimension, such that the sidewalls are tapered from a lower region to an upper region. A high k dielectric liner is formed on the sidewalls and a conductive liner is formed on the high k dielectric liner. A conductive material is in the trench and is adjacent to the conductive liner. The conductive material has a first dimension at the lower end of the trench that is smaller than a second dimension at the upper end of the trench.
Public/Granted literature
- US20160181384A1 REDUCED TRENCH PROFILE FOR A GATE Public/Granted day:2016-06-23
Information query
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